Photoelectric conversion element and image sensor using same
A photoelectric conversion element and image sensor technology, applied in the field of image sensors, can solve the problems of reduced sensitivity and reduced light volume, and achieve the effects of small dark current, high photoelectric conversion efficiency, and high color selectivity
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Embodiment 1
[0193] Photoelectric conversion elements using Compound D-1 and Compound A-1, both of which have the same skeleton, were fabricated as follows.
[0194] A glass substrate (manufactured by Asahi Glass Co., Ltd., 15 Ω / □, electron beam deposition product) on which a 150-nm ITO transparent conductive film was deposited was cut into 30×40 mm and etched. The obtained substrate was ultrasonically cleaned with acetone and "Semico Clean (registered trademark) 56" (manufactured by Furuuchi Chemical Co., Ltd.) for 15 minutes each, and then washed with ultrapure water. Next, it was ultrasonically washed with isopropanol for 15 minutes, then immersed in hot methanol for 15 minutes, and dried. This substrate was subjected to UV-ozone treatment for 1 hour immediately before device fabrication.
[0195] Next, 30nm of PEDOT / PSS (Clevios TM P VP AI4083) as an electron blocking layer. The substrate was set in a vacuum evaporation device, and exhausted so that the vacuum degree in the device ...
Embodiment 2~11
[0210] When vapor-depositing the photoelectric conversion layer, instead of Compound D-1 and Compound A-1, vapor-deposition was performed in the same manner as in Example 1 except that the combinations of p-type semiconductor materials and n-type semiconductor materials shown in Table 1 were used for vapor deposition. Fabrication of photoelectric conversion elements. The results are shown in Tables 1-2.
[0211] [chemical formula 8]
[0212]
[0213] [chemical formula 9]
[0214]
[0215] [chemical formula 10]
[0216]
[0217] [chemical formula 11]
[0218]
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