Low-resistance electric conduction adhesive

A conductive adhesive, low resistance technology, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the problems of low conductivity, low stability, high density, etc., to achieve good conductivity and stability Good, strong bonding effect

Inactive Publication Date: 2017-09-05
钱龙风
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the development of traditional conductive adhesives also encountered

Method used

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Embodiment Construction

[0011] A low-resistance conductive adhesive according to the present invention provides a low-resistance conductive adhesive, comprising polyacrylate, boron nitride, zinc oxide, conductive filler, silver powder and polydimethylsiloxane, and its raw material components By weight, 10-20 parts of polyacrylate, 20-30 parts of boron nitride, 20-30 parts of zinc oxide, 10-15 parts of conductive filler, 15-20 parts of silver powder, 10 parts of polydimethylsiloxane -18 servings.

[0012] As a preference, the low-resistance conductive adhesive is characterized in that: its raw material components include 20 parts of polyacrylate, 30 parts of boron nitride, 30 parts of zinc oxide, 15 parts of conductive filler, and 20 parts of silver powder by weight. , 18 parts of polydimethylsiloxane.

[0013] Preferably, the low-resistance conductive adhesive is characterized in that: the boron nitride is a mixture of methyl silicone oil, methyl vinyl silicone rubber, and methyl phenyl silicone res...

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Abstract

The present invention relates to a low-resistance electric conduction adhesive, which comprises, by weight, 10-20 parts of polyacrylate, 20-30 parts of boron nitride, 20-30 parts of zinc oxide, 10-15 parts of an electric conduction filler, 15-20 parts of silver powder, and 10-18 parts of polydimethylsiloxane. The low-resistance electric conduction adhesive of the present invention has advantages of good electrical conductivity, strong bonding ability, wear resistance, high-temperature resistance, good stability, no toxicity, and environmental protection.

Description

technical field [0001] The invention relates to the field of interface heat dissipation materials, in particular to a low-resistance conductive glue. Background technique [0002] With the increasing integration density of microelectronic devices, the heat dissipation requirements of microelectronic devices are also increasing. Therefore, it is of great significance to develop an interface heat dissipation material with high conductivity. Due to its environmental friendliness and low cost, conductive adhesives have gradually replaced traditional tin-lead solder interconnect materials. However, the development of traditional conductive adhesives also encountered some bottlenecks, such as low conductivity, high density, and low stability. Contents of the invention [0003] The technical scheme adopted by the present invention to solve its technical problems is: provide a kind of low-resistance conductive glue, it is characterized in that: comprise polyacrylate, boron nitrid...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J183/04C09J183/07C09J9/02C09J11/04
CPCC09J133/08C08K2003/0806C08K2003/2296C08K2003/282C08L2201/08C08L2205/025C08L2205/035C09J9/02C09J11/04C09J183/04C08L83/04C08K3/22C08K3/08C08K3/28C08L33/08
Inventor 钱龙风
Owner 钱龙风
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