Device and method for accurate positioning measurement of ellipsometer

Abstract

The invention discloses a device and method for accurate positioning measurement of an ellipsometer. The device comprises a positioning piece, a sample table, an automatic two-dimensional mobile platform, a light intensity detector, a minipump, a microscope imaging system, a lighting source and a computer. A light spot outline can be clearly defined by utilizing a positioning hole in the positioning piece, the light intensity detector under the positioning hole is embedded in the center of the sample table, and can move accurately according to a step length together with the automatic two-dimensional mobile platform along an X-axis and a Y-axis, on the basis of using the microscope imaging system to observe and initially determining the position of the positioning hole, a light intensity value obtained by the light intensity detector is utilized to accurately adjust the position of the positioning hole so as to enable the light spot and the positioning hole to be completely superposed, then the catching frame of the microscope imaging system is moved onto the positioning hole, the catching frame represents the accurate position of the light spot, and the catching frame is positioned in a structure to be measured of a sample, thereby starting ellipsometry measurement. By the device and the method disclosed by the invention, the accurate positioning measurement specific to a concrete structure is realized, the operation is convenient, and the work efficiency is high.

Description

technical field [0001] The invention relates to the technical field of ellipsometer testing, in particular to a device and method for precise positioning measurement of an ellipsometer. Background technique [0002] The ellipsometer obtains the relevant properties of the film material by measuring the amplitude ratio and phase difference of the reflected light p component (the vibration direction is in the incident plane) and the s component (the vibration direction is perpendicular to the incident plane). The specific measurable parameters include Film thickness, refractive index, extinction coefficient, dielectric constant, porosity and crystallinity, etc. Because ellipsometry is a non-contact measurement, has no damage to the sample, has high measurement accuracy and can measure multi-layer thin films, it is widely used in the fields of micro-nano structure device manufacturing, process online control, material research, biomedical testing and other fields. [0003] The ...

AI Technical Summary

Problems solved by technology

However, this positioning method has the following problems: 1. There must be a long working distance between the microscope objective lens and the sample surface, so as not to affect the polarization light path during measurement, which leads to the inability to clearly distinguish the outline of the light spot in the observation interface of the microscope imaging system , so that the positioning of the capture frame deviates, and the optical signal loss or the optical signal falling outside the structure to be measured is collected after refraction, reflection, etc., it will cause measurement errors and even invalid analysis results; 2. To make the capture frame and light spot Relatively coincident, it is necessary to repeat the manual operation process of "sample loading-sample flipping-adjusting microscope imaging system-sample flipping again", which has low precision, complicated procedures and low efficiency

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