A microchannel evaporator with staggered zigzag rib walls

Abstract

The invention discloses a micro-channel evaporator with staggered saw-tooth type rib walls, which belongs to the technical field of microelectronic chip cooling. The evaporator consists of an upper cover plate, a silicon substrate processed with staggered saw-tooth micro-channels and a heating film. Among the staggered saw-tooth type micro-channels on the silicon substrate, converging and connecting boxes are arranged. The heating film, as a simulated heat source, heats the micro-channels. When liquid phase working medium flows in from the liquid entering mouth, it inhales the heat in the micro-channels and is subjected to the gas-liquid phase change so as to cool the silicon substrate. On the saw-tooth roots of the rib walls on the micro-channels, a plurality of nucleated cavities are formed. The saw-tooth structure plays a role in similar like a fine blood vessel, making it possible to form high efficient and stable heat transmission mode for the annular gas-liquid phase split flow in the channels easily. The present invention has a lower boiling start superheat degree, an efficient and stable heat transfer capacity and a high critical heat flux density. Therefore, the evaporator has broad application prospects in the field of microelectronics chip cooling technology.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of microelectronic chips, and in particular relates to a microchannel evaporator with staggered zigzag rib walls. Background technique [0002] With the development of miniaturization and high integration of microelectronic devices, the number of integrated electronic components per unit area continues to increase, resulting in a substantial increase in the heat flux density per unit area of ​​electronic equipment, and the performance and life of the equipment are closely related to the heat dissipation capability. Traditional Heat dissipation systems such as fins and fans have been unable to meet the heat dissipation requirements of the equipment. Microchannels have the advantages of high heat transfer coefficient, compact structure, and good temperature uniformity. During the phase transition process, since the fluid absorbs a large amount of latent heat of vaporization when it changes ...

AI Technical Summary

Problems solved by technology

[0002] With the development of miniaturization and high integration of microelectronic devices, the number of integrated electronic components per unit area continues to increase, resulting in a substantial increase in the heat flux density per unit area of ​​electronic equipment, and the performance and life of the equipment are closely related to the heat dissipation capability. Traditional Cooling systems such as fins and fans can no longer meet the cooling needs of the device

Microchannels have the advantages of high heat transfer coefficient, compact structure, and good temperature uniformity. During the phase transition process, since the fluid absorbs a large amount of latent heat of vaporization when it changes from liquid to gaseous, effective heat dissipation can be achieved. Therefore, based on microchannel flow boiling phase Variable cooling technology has great application prospects in the field of heat dissipation of electronic equipment, but in the phase change heat transfer system, there are problems such as excessive temperature at the initial point of boiling leading to overheating of the device, thermal fatigue damage of the device caused by flow instability, etc., which are effectively solved by the present invention It has broad application prospects for reducing the temperature of the boiling initiation point in the phase change heat transfer system, improving the heat transfer coefficient and suppressing the instability of heat transfer.

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