Polishing solution and preparation method thereof
A technology of polishing liquid and content, which is applied in the field of polishing liquid, can solve the problems of slow oxidation speed of polishing liquid, poor polishing effect, and inconspicuous selective corrosion, and achieve the effect of obvious selective corrosion effect, high oxidation speed and simple method
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Embodiment 1
[0020] A method for preparing a polishing liquid, wherein the preparation method comprises: mixing 100g of sulfuric acid, 20g of nitric acid, 5g of hydrochloric acid, 2g of an antifoaming agent, 50g of water, and 1g of an auxiliary oxidant with stirring (the stirring speed is 800r / min) to form a mixed Solution A: heat the mixed solution A (heating temperature is 30°C, heating time is 5min), add 5g of copper sulfate and 2g of silicon dioxide, stir and mix, and stand still to obtain the polishing solution A1.
Embodiment 2
[0022] A method for preparing a polishing liquid, wherein the preparation method comprises: mixing 100g of sulfuric acid, 30g of nitric acid, 10g of hydrochloric acid, 5g of an antifoaming agent, 70g of water, and 4g of auxiliary oxidant with stirring (the stirring speed is 1000r / min) to form a mixed Liquid A: heat the mixed liquid A (heating temperature is 45°C, heating time is 10 min), and add 15g of copper sulfate and 8g of silicon dioxide, stir and mix, and stand still to obtain the polishing liquid A2.
Embodiment 3
[0024] A method for preparing a polishing liquid, wherein the preparation method comprises: mixing 100g of sulfuric acid, 25g of nitric acid, 8g of hydrochloric acid, 3g of an antifoaming agent, 60g of water, and 2g of auxiliary oxidant with stirring (the stirring speed is 900r / min) to form a mixed Liquid A: heat the mixed liquid A (heating temperature is 35°C, heating time is 8 min), and add 10g of copper sulfate and 5g of silicon dioxide, stir and mix, and stand still to obtain the polishing liquid A3.
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