Polishing solution and preparation method thereof

A technology of polishing liquid and content, which is applied in the field of polishing liquid, can solve the problems of slow oxidation speed of polishing liquid, poor polishing effect, and inconspicuous selective corrosion, and achieve the effect of obvious selective corrosion effect, high oxidation speed and simple method

Inactive Publication Date: 2017-10-20
合肥博之泰电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a polishing liquid and its preparation method, which solve

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A method for preparing a polishing liquid, wherein the preparation method comprises: mixing 100g of sulfuric acid, 20g of nitric acid, 5g of hydrochloric acid, 2g of an antifoaming agent, 50g of water, and 1g of an auxiliary oxidant with stirring (the stirring speed is 800r / min) to form a mixed Solution A: heat the mixed solution A (heating temperature is 30°C, heating time is 5min), add 5g of copper sulfate and 2g of silicon dioxide, stir and mix, and stand still to obtain the polishing solution A1.

Embodiment 2

[0022] A method for preparing a polishing liquid, wherein the preparation method comprises: mixing 100g of sulfuric acid, 30g of nitric acid, 10g of hydrochloric acid, 5g of an antifoaming agent, 70g of water, and 4g of auxiliary oxidant with stirring (the stirring speed is 1000r / min) to form a mixed Liquid A: heat the mixed liquid A (heating temperature is 45°C, heating time is 10 min), and add 15g of copper sulfate and 8g of silicon dioxide, stir and mix, and stand still to obtain the polishing liquid A2.

Embodiment 3

[0024] A method for preparing a polishing liquid, wherein the preparation method comprises: mixing 100g of sulfuric acid, 25g of nitric acid, 8g of hydrochloric acid, 3g of an antifoaming agent, 60g of water, and 2g of auxiliary oxidant with stirring (the stirring speed is 900r / min) to form a mixed Liquid A: heat the mixed liquid A (heating temperature is 35°C, heating time is 8 min), and add 10g of copper sulfate and 5g of silicon dioxide, stir and mix, and stand still to obtain the polishing liquid A3.

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PUM

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Abstract

The invention discloses a polishing solution and a preparation method thereof. The preparation method comprises the following steps: stirring and mixing sulfuric acid, nitric acid, hydrochloric acid, a defoaming agent, water and an auxiliary oxidant to form a mixed liquor A; and heating the mixed liquor A, adding copper sulfate and silicon dioxide, stirring and mixing again, and leaving to stand, so as to obtain the polishing solution. The polishing solution and the preparation method thereof have the benefits as follows: the problems that oxidation velocity of the common polishing solution is low, the polishing effect is poorer and the preferential etching effect is not obvious are solved.

Description

technical field [0001] The invention relates to a polishing liquid, in particular to a polishing liquid and a preparation method thereof. Background technique [0002] The polishing liquid is a water-soluble polishing agent without any sulfur, phosphorus, and chlorine additives. It has good oil removal, rust prevention, cleaning and gloss enhancement properties, and can make metal products exceed the original luster. The oxidation speed of ordinary polishing liquid is slow, resulting in poor polishing effect, and the selective corrosion is not obvious. [0003] Therefore, it is an urgent problem to be solved in the present invention to provide a polishing liquid with fast oxidation speed, obvious polishing effect and preferential corrosion effect and its preparation method. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a polishing liquid and its preparation method, which solves the problems that the ordinary p...

Claims

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Application Information

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IPC IPC(8): C23F3/00
CPCC23F3/00
Inventor 王飞
Owner 合肥博之泰电子科技有限公司
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