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A kind of different direction conductive adhesive film and preparation method thereof

A technology of conductive adhesive film and different directions, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., and can solve the problems of inability to form conductive channels, destructive crushing of conductive microspheres, etc.

Active Publication Date: 2020-05-19
新纶电子材料(常州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the prior art, during the use of the anisotropic conductive adhesive film, due to the problem of excessive construction pressure, the conductive microspheres are often crushed destructively, and the conductive channel cannot be formed.

Method used

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  • A kind of different direction conductive adhesive film and preparation method thereof
  • A kind of different direction conductive adhesive film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] This embodiment provides a different-direction conductive adhesive film, the raw materials of which include a colloidal raw material and a solvent, the solvent is a toluene / ethyl acetate mixed solvent, the mixing ratio is 1:1, and the amount thereof accounts for 60% of the total weight of the raw materials;

[0048] In parts by weight, the colloidal raw materials include:

[0049] Thermoplastic elastomer 100 parts,

[0050] Latent curing agent (flexible 2-heptadecyl imidazole modified curing agent) 100 parts,

[0051] Liquid epoxy resin 1 (ordinary epoxy resin, its epoxy equivalent is 185 g / ep~195g / ep) 80 parts,

[0052] Liquid epoxy resin 2 (bisphenol A liquid epoxy resin, its epoxy equivalent is 245 g / ep~270g / ep) 100 parts,

[0053] Solid epoxy resin (bisphenol A solid epoxy resin, its epoxy equivalent is 450 g / ep~500g / ep) 20 parts,

[0054] 20 parts of conductive particles,

[0055] 20 parts of spherical alumina,

[0056] Antioxidant (tetra[β-(3,5-di-tert-butyl-...

Embodiment 2

[0067] This embodiment provides a different direction conductive adhesive film, the raw materials of which include colloidal raw materials and solvents, the solvent is a mixed solvent of toluene / ethyl acetate, the ratio of the mixed solvent is 1:1, and its consumption accounts for 65% of the total weight of raw materials ;

[0068] In parts by weight, the colloidal raw materials include:

[0069] Thermoplastic elastomer 100 parts,

[0070] Latent curing agent (flexible 2-heptadecyl imidazole modified curing agent) 100 parts,

[0071] Liquid epoxy resin 1 (ordinary epoxy resin, its epoxy equivalent is 185 g / ep~195 g / ep) 100 parts,

[0072] Liquid epoxy resin 2 (bisphenol A liquid epoxy resin, its epoxy equivalent is 245 g / ep~270 g / ep) 80 parts,

[0073] Solid epoxy resin (bisphenol A solid epoxy resin, its epoxy equivalent is 450 g / ep~500 g / ep) 20 parts,

[0074] 25 parts of conductive particles,

[0075] 25 parts of spherical alumina,

[0076] Antioxidant (tetra[β-(3,5-d...

Embodiment 3

[0086] This embodiment provides a different-direction conductive adhesive film, the raw materials of which include colloidal raw materials and solvents, the solvent is a toluene / ethyl acetate mixed solvent, the ratio of the mixed solvent is 1:1, and its consumption accounts for 70% of the total weight of the raw materials ;

[0087] In parts by weight, the colloidal raw materials include:

[0088] Thermoplastic elastomer 95 parts,

[0089] Latent curing agent (flexible 2-heptadecyl imidazole modified curing agent) 80 parts,

[0090] Liquid epoxy resin 1 (ordinary epoxy resin, its epoxy equivalent is 185 g / ep~195g / ep) 80 parts,

[0091] Liquid epoxy resin 2 (bisphenol A liquid epoxy resin, its epoxy equivalent is 245 g / ep~270g / ep) 100 parts,

[0092] Solid epoxy resin (bisphenol A solid epoxy resin, its epoxy equivalent is 450 g / ep~500g / ep) 10 parts,

[0093] 30 parts of conductive particles,

[0094] 30 parts of spherical alumina,

[0095] Antioxidant (tetra[β-(3,5-di-te...

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Abstract

The invention provides an anisotropic conductive film which comprises a colloid raw material and a solvent as raw materials, wherein the solvent accounts for 60-70% by total weight of the raw materials; the colloid raw material comprises the following components in parts by weight: 90-100 parts of a thermoplastic elastomer, 60-100 parts of a latent curing agent, 80-100 parts of a liquid epoxy resin 1, 80-100 parts of a liquid epoxy resin 2, 10-30 parts of a solid epoxy resin, 20-30 parts of conductive particles, 20-30 parts of graphic aluminum oxide, 0-5 parts of an antioxidant, 0-5 parts of a thixotropic agent and 0-10 parts of a silane coupling agent. The anisotropic conductive film provided by the invention is capable of preventing conductive microspheres from being damaged, and thus the utilization rate of the conductive film is increased.

Description

technical field [0001] The invention relates to a different-direction conductive adhesive film and a preparation method thereof, belonging to the field of optoelectronic technology. Background technique [0002] Directional conductive adhesive films include isotropic conductive adhesive films and anisotropic conductive adhesive films. Among them, the anisotropic conductive adhesive film is a conductive adhesive film used for the packaging of electronic components, and has a good application prospect in the packaging industries such as IC, RFID, and touch screen. With the continuous development of domestic high-tech, major domestic semiconductor manufacturers and packaging companies such as liquid crystal modules have increasingly strong demand for anisotropic conductive film. [0003] The filler of the anisotropic conductive adhesive film is mostly conductive microspheres with a narrow distribution. The mechanism of conduction is simply that after applying a suitable pressu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J175/04C09J11/08C09J11/04C09J9/02C09J7/40
CPCC08L2203/16C08L2205/025C08L2205/035C09J9/02C09J11/04C09J11/08C09J163/00C09J2203/326C09J2301/122C09J2301/314C08L63/00C08L75/04C08K13/04C08K7/18C08K2003/2227
Inventor 冒小峰岳威
Owner 新纶电子材料(常州)有限公司