Copper-clad ceramic substrate manufacturing method

A technology of copper-clad ceramic substrate and manufacturing method, which is applied in printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of increasing environmental pressure, inconvenient recycling, complex process, etc., to reduce the pressure of wastewater treatment and facilitate recycling. , the effect of good isolation performance

CN107295755AInactive Publication Date: 2017-10-24SHUNSIN TECH (ZHONG SHAN) LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2017-10-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a copper-clad ceramic substrate manufacturing method. The method comprises steps: a copper sheet is stamped to form a copper circuit board in a predetermined shape; the copper circuit board and the ceramic substrate are attached; and through direct copper joint, the copper circuit board and the ceramic substrate are sintered. According to the copper-clad ceramic substrate manufacturing method disclosed in the invention, the processing process is simplified, steps such as film mounting, exposure, development, etching and film removal in the existing processing process are cancelled, needed materials and device kinds are reduced, and the economical efficiency is improved; stamping to form the copper circuit board is used to replace the etching process, copper material recovery and utilization are facilitated, the pressure of wastewater treatment is reduced, and the method is environment-friendly; and besides, the copper circuit board formed through stamping is good in circuit perpendicularity, and the isolation performance is good.
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Description

technical field

[0001] The invention relates to the technical field of ceramic substrate metallization, in particular to a method for manufacturing a copper-clad ceramic substrate. Background technique

[0002] Direct copper bonding technology, referred to as DBC (Direct Bonding Copper), is heat treatment in a temperature range lower than the melting point of metallic copper (about 1083°C) and higher than the eutectic temperature of copper and copper oxide (about 1063°C) , a technical means to make the external structure and copper produce eutectic bonding and fixed connection. Copper clad ceramic substrate is a typical product using direct copper bonding technology, which is mainly used in the field of product packaging with high power and high heat dissipation requirements.

[0003] figure 1 It is a typical processing flow chart of the copper-clad ceramic substrate in the prior art, figure 2 for with figure 1 Schematic diagram of the structure of the corresponding cop...

Examples

Embodiment Construction

[0020] refer to image 3 As shown, the manufacturing method of the copper-clad ceramic substrate disclosed in the present invention comprises:

[0021] S1, stamping the copper sheet to form a copper circuit board 1 of a predetermined shape;

[0022] S2, laminating the copper circuit board 1 and the ceramic substrate 2;

[0023] S3 , sintering the copper circuit board 1 and the ceramic substrate 2 by direct bonding copper (Direct Bonding Copper, DBC). The copper circuit board 1 formed by stamping has neat side walls and is perpendicular to the ceramic 2 substrate, has good isolation performance, and has a simple process and low cost. In specific implementation, the copper circuit board 1 and the ceramic substrate 2 can be sintered by heating oxidation method, wherein the oxidation temperature is 950°C-1100°C, and the oxidation time is 20min-35min. During the heating oxidation process, the oxidation atmosphere can be preferably It is a weak oxygen atmosphere under the protect...