Target material structure of film forming device

A technology of film-forming equipment and target material, which is applied in the field of target material structure, can solve the problem of not being able to obtain a performance film layer on the surface of the substrate, and achieve the effect of uniform thickness and improved performance

Active Publication Date: 2017-11-03
北京芯微诺达科技有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This has caused the problem of not being able to obtain a stable film layer on the surface of the substrate

Method used

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  • Target material structure of film forming device
  • Target material structure of film forming device
  • Target material structure of film forming device

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] The object of the present invention is to provide a target material structure of a film-forming equipment to solve the above-mentioned problems in the prior art, so that a film with uniform thickness can be obtained on the surface of the substrate.

[0025] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accomp...

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Abstract

The invention discloses a target material structure for a film forming device. The target material structure for the film forming device comprises a film forming chamber. A target material is arranged on one side in the film forming chamber. The target material comprises an inner target material and an outer target material. The inner target material and the outer target material do not make contact. The inner target material is sleeved with the outer target material. The inner target material and the outer target material are connected with a power source. All the power sources are both electrically connected with a control system. According to the target material structure for the film forming device, the target material is designed into the inner target material and the outer target material, so that the thickness of a film deposited on a substrate is more uniform and more consistent, the physical property of the film is improved, and the performance of the substrate is further improved.

Description

technical field [0001] The invention relates to the technical field of physical vapor deposition, in particular to a target structure of a film forming device. Background technique [0002] Physical vapor deposition (Physical Vapor Deposition, referred to as PVD) refers to the use of physical processes to achieve material transfer, the process of transferring atoms or molecules from the target to the surface of the substrate. Its function is to spray some particles with special physical properties (high strength, wear resistance, heat dissipation, corrosion resistance, etc.) on the substrate with lower performance, so that the substrate has better performance. Physical vapor deposition includes four categories of vacuum evaporation coating, sputtering coating, ion beam and ion-assisted and epitaxial film deposition techniques. [0003] The principle of sputtering coating (Sputter) is that the ionized gas ions (such as Ar ions) are accelerated by the cathode and quickly coll...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/54
CPCC23C14/3407C23C14/546C23C14/547
Inventor 卢艳
Owner 北京芯微诺达科技有限公司
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