Leveling agent, metal electroplating composition containing same and preparation method and application of metal electroplating composition
A technology of metal electroplating and composition, which is applied in the field of leveling agent, and can solve the problems of good throwing property, small surface roughness, and low coating impurity
Active Publication Date: 2017-11-07
SHANGHAI SINYANG SEMICON MATERIALS
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Problems solved by technology
[0008] The technical problem to be solved by the present invention is to overcome the defects that the electroplating composition in the prior art cannot yet achieve no voids and defects, low coating impurities, good throwing property, compact structure, and small surface roughness, and provide an overall Leveling agent, metal electroplating composition containing it, preparation method, and application
Method used
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preparation example Construction
[0070] 2, the preparation method of metal electroplating composition
[0071] The preparation method of the metal electroplating composition of Examples 1-7 is as follows: add the copper electroplating solution into the bath container, then add leveling agent, accelerator and inhibitor, and mix uniformly.
[0072] 3. Electroplating process parameters
[0073] The metal electroplating composition of Examples 1-7 is used, and electroplating is performed according to the electroplating process parameters in Table 2.
[0074] Table 2
[0075]
[0076] 4. Effect data
[0077] The resulting electroplated products were tested for impurity content, voids, throwing properties, structural compactness, and surface roughness. The results are shown in Table 3. Among them, the determination of impurity content is analyzed by combustion method in elemental analysis, and the determination of void condition, throwing property, structural compactness and surface roughness is observed by S...
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The invention discloses a leveling agent, a metal electroplating composition containing the same and a preparation method and application of the metal electroplating composition. Raw materials of the metal electroplating composition comprise a metal electroplating solution and the leveling agent; the metal electroplating solution comprises metal salt, acidic electrolyte, a halogen ion source and water; the metal salt is copper salt; and the leveling agent is a chemical compound in the formula I structure. The metal electroplating composition is used for electroplating of a printed circuit board and electroplating of an integrated circuit wafer or a chip, good heat reliability and uniform plating capacity can be provided, and the sealing problem of a hole opening can be solved; and a product obtained after electroplating is free of holes and defects, low in plating layer impurity content, good in uniform plating performance, compact in structure and small in surface roughness degree.
Description
technical field [0001] The invention relates to a leveling agent, a metal electroplating composition containing the same, a preparation method and an application. Background technique [0002] With the development of Very Large Scale Integration (VLSI) and Ultra Large Scale Integration (ULSI), the level of integration continues to increase, and circuit components become more and more dense. Chip interconnection has become a key factor affecting chip performance. However, the scaling down of interconnect lines in VLSI and ULSI technologies has placed additional demands on processing capabilities due to size constraints of the circuitry. Such requirements include precise machining of multi-layered, high-aspect-ratio structural features. The reliability of these interconnect structures plays a very important role in the success of VLSI and ULSI and the improvement of circuit density. [0003] As the circuit density increases, the line width of interconnect lines, the size of ...
Claims
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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 王溯高学朋施立琦
Owner SHANGHAI SINYANG SEMICON MATERIALS