A copper wire tinning cleaning device

Abstract

The invention relates to the technical field of tinplating devices, in particular to a copper wire tinplating cleaning device. The copper wire tinplating cleaning device comprises a handle, a spray head, an acid solution pipe and a clear water pipe. The front ends of the acid solution pipe and the clear water pipe are a connected integrated part, and the rear ends of the acid solution pipe and the clear water pipe are branched single pipe parts. The liquid outlet ends of the acid solution pipe and the clear water pipe are installed in a clamping groove in the handle in an inserted mode, and the spray head is slidably connected to the clamping groove. According to the copper wire tinplating cleaning device, the practicability is sufficiently considered for material selecting, the manufacturing cost is low, in the using process, the spray head and brush bristles are conveniently installed, replacing is facilitated, the clean and sanitary effects are achieved, two center pipes are matched for using, and therefore the situation that by twice the result is yielded with half the effort is achieved; outdoor carrying is convenient for a worker, during using, only a liquid storage bag needs to be kneaded by hands, and the time and labor do not need to be wasted; impurities on the surface of a copper wire are washed off through an acid solution firstly, then the surface of the copper wire are washed to be clean through clear water, and finally, drying is conducted through a drying device; and the copper wire tinplating cleaning device has the advantages of being high in cleaning efficiency and good in effect.

Description

technical field [0001] The invention relates to the technical field of tinning devices, in particular to a tinning and cleaning device for copper wires. Background technique [0002] Tinned copper wire is widely used in industry and electronics industry. Tinned copper wire needs to be electroplated by putting the copper wire in the electroplating water tank so that a layer of tin is attached to the surface of the copper wire to obtain tinned copper wire. Currently, electroplating The processing is to directly put the copper wire into the electroplating tank for electroplating processing, and the surface of the copper wire to be electroplated will have certain impurities, so that the tin-plated layer will cover the impurities during electroplating, so that the tin-plated copper surface will have impurity bumps. And the impurities are easy to fall off, resulting in poor quality of tinned copper wire. [0003] Chinese Invention Patent Application No. 201510161588.3 discloses a...

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Problems solved by technology

Although the above-mentioned invention can clean the impurities on the surface of the copper wire, the device used in the design process is too much, the structure is relatively complicated, and it is not suitable for the staff to carry it outdoors.

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