Field emission device and manufacture method thereof
A technology of field emission devices and manufacturing methods, applied in the direction of electrical components, cold cathode manufacturing, electrode system manufacturing, etc., to achieve the effects of simplifying the process, improving performance, and reducing costs
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0031] figure 1 A perspective view of a field emission device according to an embodiment of the present invention.
[0032] refer to figure 1 , The field emission device according to the embodiment of the present invention includes a substrate 10, a buffer layer 20 disposed on the substrate 10, an emitter layer 30 and a metal collector layer 40 respectively disposed on both ends of the buffer layer 20, a first electrode layer 101 disposed on the emitter layer 30 and a second electrode layer 102 disposed on the metal collector layer 40, wherein there is a channel 100 between the emitter layer 30 and the metal collector layer 40, In order to realize the ballistic transport of electrons under atmospheric pressure, preferably, the metal collector layer 40 uses a chromium / gold composite thin film electrode or a molybdenum thin film electrode.
[0033] Wherein, the substrate 10 may be made of sapphire, gallium nitride or silicon carbide, etc.; the buffer layer 20 may be made of hi...
Embodiment 2
[0048] refer to image 3 The difference between this embodiment and Embodiment 1 is that the side end of the emitter layer 30 has a plurality of pointed protrusions 30a, and correspondingly, the side of the metal collector layer 40 facing the emitter layer 30 has a plurality of pointed recesses 40a, The plurality of pointed protrusions 30a and the plurality of pointed recesses 40a form a sawtooth shape interfitting with each other. The manufacturing method of the field emission device in this embodiment is the same as that in Embodiment 1, and will not be repeated here.
[0049] The collector electrode in the field emission device of the present invention is made of metal, and the angle of the cusp of the emitter can be designed to be any angle according to the performance of the field emission device. Moreover, since the collector electrode is made of metal material, the wet process It is not necessary to add a mask when etching the dielectric film layer to form a nano-pitch,...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


