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Method for manufacturing flexible backplane, liquid crystal display panel and OLED display panel

A manufacturing method and backplane technology, applied in the direction of climate sustainability, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of reducing product yield, damaging the active layer, etc., and achieve the effect of improving flexibility

Active Publication Date: 2017-11-17
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when punching holes, if you are not careful, the active layer will be damaged and the product yield will be reduced.

Method used

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  • Method for manufacturing flexible backplane, liquid crystal display panel and OLED display panel
  • Method for manufacturing flexible backplane, liquid crystal display panel and OLED display panel
  • Method for manufacturing flexible backplane, liquid crystal display panel and OLED display panel

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Embodiment Construction

[0020] refer to figure 1 , figure 1 It is a structural schematic diagram of an embodiment of a manufacturing method of a flexible backplane provided by the present invention. The flexible backplane includes a plurality of pixel regions 11 , an isolation region 12 between the plurality of pixel regions 11 and a binding region 13 .

[0021] Among them, a plurality of pixel regions 11 are distributed in an array to form an AA (Active Area) region of the backplane, and an isolation region 12 is formed between two adjacent pixel regions 11. It is worth noting that the isolation region 12 is only used for Isolating the TFTs of two pixels does not separate the two pixels.

[0022] Wherein, the binding area (ie, bongding area) 13 is generally located at the edge of the display panel, and is used for setting various circuits, such as driving circuits.

[0023] It can be understood that in the manufacturing process of the following embodiments, each interlayer structure of the backpla...

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Abstract

The invention discloses a method for manufacturing flexible backplane, a liquid crystal display panel and an OLED display panel. The method herein includes the following steps: providing a substrate; successfully manufacturing a buffer layer, an active layer, and a gate insulation layer on the substrate; manufacturing a gate in a corresponding pixel region on the gate insulation layer, and manufacturing an etching barrier layer in a corresponding isolation layer; manufacturing a second insulation layer on the gate and the etching barrier layer; using a first etching technology to manufacture a first via hole in the isolation region of the second insulation layer and manufacture a second via hole in a bonding region; applying an organic material to the second insulation layer, and filling the organic material to the first via hole and the second via hole so as to form an organic filling layer; and manufacturing a source electrode and a drain electrode on the organic filling layer. In this way, according to the invention, the method does not cause damage to the active layer with no manufacturing procedure increased and also can increase the flexibility of the backplane.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for manufacturing a flexible backplane, a liquid crystal display panel, and an OLED display panel. Background technique [0002] As AMOLED (Active-matrix organic light emitting diode, active-matrix organic light-emitting diode) display technology becomes more and more mature in the industry, the demand for display screens of portable electronic devices has gradually become the demand for flexible AMOLED display screens. need. Flexible OLED displays have the advantages of being lighter and thinner, lower power consumption, and can be bent into any shape to meet the market demand for wearable devices. [0003] In order to improve the flexibility of the panel, the panel is generally perforated, and organic materials are filled in the holes to improve the flexibility of the panel. However, if you are not careful when punching holes, the active layer will be damaged and th...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/50H01L51/52H01L51/56H01L51/00
CPCH10K59/12H10K77/10H10K50/80H10K50/00H10K71/00Y02E10/549Y02P70/50
Inventor 王国超
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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