Virtual die matching method based on measurement

A technology of mold matching and measuring points, which is applied in the field of virtual mold matching based on measurement, can solve the problems of mold matching in measurement technology, and achieve the effects of improving mold matching efficiency, quantifying out-of-tolerance, and reducing manual steps.

Active Publication Date: 2017-11-24
NORTHWESTERN POLYTECHNICAL UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Currently, there is no method for mold

Method used

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  • Virtual die matching method based on measurement
  • Virtual die matching method based on measurement
  • Virtual die matching method based on measurement

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Experimental program
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Embodiment Construction

[0027] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0028] see figure 1 , the present invention is based on the virtual model matching method of measurement comprising the following steps:

[0029] 1) see figure 2 , read in and analyze the model file, datum plane measurement data, and fit the assembly datum plane;

[0030] 1.1) Read in the model files of the punch and die, and obtain the world coordinate system LW and the initial local coordinate system LA of the punch in the assembly environment 0 , Die initial local coordinate system LB 0 ;

[0031] 1.2) Read in the reference plane measurement data file and the clamping accuracy Tol O , to check the correctness of the data;

[0032] 1.3) Fit the assembly datum plane according to the datum plane measurement data file.

[0033] 1.3.1) see image 3 , record the measurement point set of the base plane of the punch as The measurement point set of the b...

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Abstract

The invention discloses a virtual die matching method based on measurement and aims to decrease the manual operation steps in the die matching process, quantify the out-of-tolerance quantity of die matching key points, guide die trimming and improve the one-time die-matching success rate. According to the technical scheme, the virtual die matching method based on measurement comprises the steps that 1, model files and reference plane measurement data are read, initial local coordinate systems of male and female dies are obtained, and an assembly reference plane is fit; 2, mode locking analysis is performed, the assembly reference plane is fit in a die-locking precision range, and local coordinates of the male and female dies are solved; 3, parting surface measurement data is read, parting surface interference analysis is performed in a parting surface precision range, differences are calculated, and out-of-tolerance points of the parting surface are obtained; 4, virtual die matching results are displayed and output. The die trimming can be guided according to quantified die matching results, and the die matching efficiency can be improved.

Description

technical field [0001] The invention belongs to the field of mold production, and in particular relates to a measurement-based virtual mold matching method. Background technique [0002] A mold is a precision tool for making shaped objects. Different molds are composed of different parts and have high processing requirements. The production process of the mold includes: mold design, NC programming, rough machining, heat treatment, finishing, mold matching, polishing and mold trial process. After the finishing of the mold is completed, it is necessary to match the mold to check the quality of the mold, and carry out the mold repair work according to the result of the mold matching. [0003] For the virtual assembly of molds, the traditional method is to use computer-aided design methods to describe and express the product’s assemblability evaluation intuitively, and provide 3D animation to show the assembly simulation process of the product, effectively verifying the correct...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/17G06F30/20G06F2111/04G06F2119/18
Inventor 蔡锐龙魏杰梁星星
Owner NORTHWESTERN POLYTECHNICAL UNIV
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