Semiconductor device and packaging method thereof

Abstract

The invention provides a semiconductor device and an encapsulation method thereof. The semiconductor device comprises a semiconductor substrate, and an encapsulation layer, wherein a first cavity is formed between the surface of partial semiconductor substrate and a sensing layer, a protective layer is formed on the sensing layer, and partial sensing layer exposed from the protective layer is used as a sensing window; the encapsulation layer is arranged on the protective layer, an opening above the first cavity is arranged in the encapsulation layer, and a second cavity is formed between the encapsulation layer and the protective layer. In the semiconductor device provided by the invention, the encapsulation layer is formed on the semiconductor substrate, the encapsulation layer is arranged on the protective layer, the second cavity is formed in front of the protective layer, and the opening in the encapsulation layer is arranged above the first cavity, thereby exposing the sensing window on the first cavity; the indication window can sense the pressure from the external, and the detection on the pressure is realized. The encapsulation layer is directly formed on the semiconductor substrate, the encapsulation of the semiconductor substrate is finished, and the process is simple and convenient.

Description

Technical field [0001] The present invention relates to the technical field of microelectromechanical systems, in particular to a semiconductor device and a packaging method thereof. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) is a micro-device or system that can be integrated into production, integrating micro-mechanisms, micro-sensors, micro-actuators, and signal processing and control circuits. It is developed with the development of semiconductor integrated circuit micro-processing technology and ultra-precision machining technology. Microelectronic devices using MEMS technology have very broad application prospects in aviation, aerospace, environmental monitoring, biomedicine and almost all fields that people come into contact with. [0003] MEMS sensors have been used in various fields. Due to the needs of the working environment, MEMS sensors must adopt an effective packaging structure and packaging method. The existing packaging method is to manu...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a semiconductor device and its packaging method, which solves the problems of complex packaging process and low integration in the prior art

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