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Small-size spark discharge low-temperature plasma device

A low-temperature plasma and spark discharge technology, applied in the field of plasma, can solve the problems of poor flexibility, fixed discharge intensity, and high cost, and achieve the effects of high flexibility, portability, and a wide range of applications

Inactive Publication Date: 2017-12-12
NANJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention proposes a small spark discharge low-temperature plasma device, and its purpose is to solve the problem that the discharge frequency of the existing low-temperature plasma technology is fixed, and the plasma dose acting on the object to be treated cannot be changed in a unit time; The technical discharge intensity is fixed, so the energy and action intensity generated by the discharge are not adjustable, and it cannot be flexibly adjusted according to the application requirements of the treated objects with different processing properties and requirements, and the realization of the existing spark discharge technology requires additional Gas is introduced, the structure is more complicated, the cost is higher, it is difficult to realize the miniaturization of the device, and the problem of poor flexibility

Method used

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  • Small-size spark discharge low-temperature plasma device
  • Small-size spark discharge low-temperature plasma device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] In this example, if Figure 6 The high-voltage electrode 501 in the reactor module 500 is a copper rod with a length of 60mm and a diameter of 1.5mm, which is connected to one end of a high-voltage resistant silicone wire 504, and the other end of the high-voltage resistant silicone wire 504 is connected to the male head 506 of a high-voltage resistant banana plug. connected;

[0040] The ground electrode 502 is a stainless steel hollow cylinder with an inner diameter of 7mm and an outer diameter of 9mm. A 3mm hole is opened at the low-temperature plasma jet end. One end of the high-voltage resistant silicone wire 505 is connected to it, and the other end is connected to the male head 507 of the high-voltage resistant banana plug. connected;

[0041] The distance between the front end of the high-voltage copper electrode 501 and the plasma ejection end of the ground electrode can be adjusted according to the needs. In this reactor, the distance between the electrodes i...

Embodiment 2

[0046] In this example, if Figure 7 Shown is a working reactor module 500, the high voltage electrode 501 of the reactor module 500 is a copper rod with a length of 60mm and a diameter of 0.5mm, which is connected to one end of a high-voltage resistant silicone wire 504, and the other end of the high-voltage resistant silicone wire 504 is connected to the high-voltage resistant silicone wire 504. The male head 506 of the high-voltage banana plug is connected. The ground electrode 502 is a stainless steel hollow cylinder with an inner diameter of 2 mm and an outer diameter of 3 mm. A hole of 1.5 mm is opened at the end of the low-temperature plasma jet. One end of the high-voltage resistant silicone wire 505 is connected to it, and the other end is connected to the male end of the high-voltage resistant banana plug. 507 connected. The distance between the front end of the high-voltage copper electrode 501 and the plasma ejection end of the ground electrode can be adjusted acc...

Embodiment 3

[0050] In this example, if Figure 8Shown is a working reactor module 500, the reactor high-voltage electrode 501 is a copper rod with a length of 60mm and a diameter of 5.0mm, which is connected to one end of a high-voltage resistant silicone wire 504, and the other end of the high-voltage resistant silicone wire 504 is connected to a high-voltage resistant banana The male head 506 of the plug is connected; the ground electrode 502 is a stainless steel hollow cylinder with an inner diameter of 20mm and an outer diameter of 25mm. A 15mm hole is opened at the low-temperature plasma jet end. The male head 507 of the high-voltage banana plug is connected. The distance between the front end of the high-voltage copper electrode 501 and the plasma ejection end of the ground electrode can be adjusted according to the needs of the reactor module 500. The distance between the electrodes is 2mm-10mm, and the emphasis of the spark discharge is enhanced. The distance between the electrode...

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Abstract

The invention relates to a small-size spark discharge low-temperature plasma device. The structure of the small-size spark discharge low-temperature plasma device comprises an equipment box body, a reactor module, a power module, a frequency modulation module and a charge-discharge module, wherein the power module, the frequency modulation module and the charge-discharge module are arranged in the equipment box body, a power output end of the power module is connected with a power input end of the frequency modulation module, a power output end of the frequency modulation module is connected with a power input end of the charge-discharge module, and a power output end of the charge-discharge module is connected with a power input end of the reactor module. The small-size spark discharging low-temperature plasma device has the advantages that spark discharge of three different frequency classes can be selected according to a processed object; 2, the spark discharge in different strength can be achieved; 3, the small-size spark discharge low-temperature plasma device is convenient to carry and use in different occasions; and 4, the demands of objects which are to be processed and have different properties are satisfied, and thus, the small-size spark discharge low-temperature plasma device is wide in application range and high in flexibility.

Description

technical field [0001] The invention relates to a small spark discharge low-temperature plasma device, which belongs to the technical field of low-temperature plasma. Background technique [0002] Existing low-temperature plasma treatment devices mostly use dielectric barrier discharge, sliding arc and corona discharge, which can meet the requirements of sterilization and material treatment in certain occasions, but for some high-strength material treatment and hard-to-kill bacteria And other processing requirements, its applicability is limited; Compared with these discharges, the plasma generated by spark discharge has higher intensity, but at present, spark discharge plasma is mostly used in industrial fields such as spark plugs and material preparation, and the temperature of the generated plasma Higher, higher power, and larger equipment volume, but there are not many small spark discharge low-temperature plasma technologies and devices used in the fields of biomedicine...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05H1/34
CPCH05H1/34
Inventor 方志徐楠崔行磊
Owner NANJING UNIV OF TECH