Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Three-dimensional surface topography measurement method and system based on optical microscopy

An optical microscope and three-dimensional surface technology, applied in the direction of measuring devices, optical devices, instruments, etc., can solve the problem that the detection accuracy is greatly affected, the surface texture and color information cannot be obtained, and corrosion, burns, oxidation, deterioration, etc. cannot be detected. question

Inactive Publication Date: 2017-12-26
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
View PDF3 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing optical microscopy methods mainly include interference microscopy (PSI, CSI) and confocal microscopy (CM). Due to the limitation of the principle, these two methods can only be illuminated by a coaxial light source, and it is difficult to measure the Object surface, the detection accuracy is greatly affected by the surface condition (material, color, reflectivity, roughness, etc.)
[0005] In summary, there is a lack of a measurement method in the prior art, which can measure the horizontal resolution and vertical resolution on the surface of an object, obtain the texture of the surface, and use it for the detection of special surfaces

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Three-dimensional surface topography measurement method and system based on optical microscopy
  • Three-dimensional surface topography measurement method and system based on optical microscopy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with specific embodiments.

[0030] A three-dimensional surface topography measurement method based on optical microscopy, the flow chart of the embodiment is as follows figure 2 shown, including:

[0031] S1. Select an objective lens with a suitable magnification according to the requirements of lateral resolution and field of view, initialize the scanning layer number i, and select the lighting system with the best effect according to the measured surface condition; calibrate the optical imaging system, and obtain the corresponding pixel pitch on the CCD sensor Determine the height H of the surface to be measured, select the scanning layer thickness S according to the longitudinal resolution, and start scanning when the product of the layer number and the layer thickness is gr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a three-dimensional surface topography measurement method and system based on optical microscopy, which relate to the field of micro nano object measurement. The method comprises steps: a measured surface is placed in an observation range of an optical microscope, an appropriate objective lens and a lighting system are selected, an objective lens driving system is used to drive the objective lens and the measured surface to perform longitudinal relative motion, and during a serial layer scanning process, an image acquisition module is used to acquire a sequence image, and the depth position information when each image is acquired is recorded at the same time; a focusing evaluation algorithm is used to calculate the definition value of each pixel point in the sequence image; and according to the change condition of the focusing degree of the pixel point in the image sequence, a depth calculation algorithm is used to calculate the depth information of each pixel point, and thus, three-dimensional coordinates of the pixel point are thus acquired. The method and the system are applicable to the micro nano object measurement field, the surface waviness and the roughness can be measured, the three-dimensional surface topography data are rebuilt, the material surface texture information can be acquired, and the method and the system can be used for measuring a complex surface.

Description

technical field [0001] The invention relates to the field of micro-nano object measurement, in particular to a three-dimensional surface topography measurement method and system based on optical microscopy. Background technique [0002] The surface is the boundary between the object material and the surrounding medium, and the engineering surface generally refers to the boundary between metal, plastic, etc. and air. The traces of various processing processes shown by modern engineering surfaces are called surface topography in the field of surface metrology. Surface topography is an important determinant of the performance of parts. It not only has a great influence on mechanical properties such as friction and wear, contact stiffness, fatigue strength, fit properties, and transmission accuracy of the mechanical system, but also has a great relationship with thermal conductivity, electrical conductivity, and corrosion resistance. and other physical properties are closely re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/30
CPCG01B11/30
Inventor 崔海华程筱胜卞新光戴宁
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products