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Light temperature uniformity efficient cooling device and electronic device

A technology for heat dissipation devices and electronic equipment, which is applied to the structural parts, electrical components, and decoration of electrical equipment through conduction and heat transfer. Mass, structural space reduction effect

Active Publication Date: 2017-12-26
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the traditional way of thinking is that when the heat increases to a certain level, liquid cooling is generally used instead of natural heat dissipation or forced air cooling, and liquid cooling technology is more complicated than air cooling or natural cooling, making the system tend to be bulky. The development trend and requirements for light weight and simplicity in equipment heat dissipation technology are contrary
The current natural heat dissipation and air-cooled heat dissipation devices generally use aluminum straight fins. This single structure also greatly limits the heat dissipation power of the device.

Method used

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  • Light temperature uniformity efficient cooling device and electronic device

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Effect test

Embodiment 1

[0031] Such as figure 1 As shown, a light-weight uniform temperature and high-efficiency heat dissipation device includes a device body made of copper plates. A plurality of mutually independent and non-communicating channels 11 are formed in the device body 1, and the channels 11 are installed There is a first foamed copper 2, and the space between the channel 11 and the first foamed copper 2 is a vacuum filled with a heat dissipation medium. In this embodiment, the device body made of copper plate is provided, and the channel is independently arranged in the device body, and the first foamed copper is fixed in the channel. First, the structural space occupied by the heat sink is greatly reduced, and it is more suitable for microelectronics. The heat dissipation requirements of the equipment; secondly, the heat dissipation method of fixing foamed copper in the channel greatly improves the heat dissipation power of the heat sink; finally, the foamed copper has large pores and ...

Embodiment 2

[0050] An electronic device, comprising the heat sink of the above-mentioned embodiment 1 and an electronic device body, the heat sink is installed inside the electronic device body, and one side of the outer surface of the heat sink is in contact with the heating element of the electronic device body touch. In the electronic equipment of this embodiment, by installing a heat dissipation device with copper foam in the electronic equipment body, it can not only achieve high-efficiency heat dissipation, but also meet the requirement of light weight of the electronic equipment.

[0051] The electronic device body in this embodiment may be a communication electronic device such as a radar, or may be an electronic device in other application fields. In this embodiment, after the heat dissipation device is installed on the body of the electronic equipment, depending on the heat dissipation requirements and the structure permitting, a fan can be installed near the second copper foam ...

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Abstract

The invention relates to a light temperature uniformity efficient cooling device and an electronic device. The cooling device comprises a device body made of a copper sheet. A plurality of independent channels not communicated are formed inside the device body, first foamy copper is installed inside the channels, and the space between the channels and the first foamy copper is vacuum and is filled with cooling media. By arranging the device body made of the copper sheet, the channels are independently arranged inside the device body, the first foamy copper is fixed to the channels, firstly, the structural space occupied by the cooling device is greatly decreased, and the device is more applicable to the cooling requirement of the micro type electronic device; secondly, by adopting the cooling mode that the foamy copper is fixed to the interior of the channels, the cooling power of the cooling device is greatly improved; finally, holes of the foamy copper are large, the density is low, the mass of the whole cooling structure can be greatly lowered, and the requirement for low mass of the cooling device is met.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a device suitable for uniform and high-efficiency heat dissipation of electronic equipment and electronic equipment. Background technique [0002] Theoretical research and practical application show that every 10°C increase in the temperature of a single semiconductor component in an electronic equipment system reduces the reliability of the system by about 50%. Therefore, efficient heat dissipation technology has a decisive impact on ensuring the reliability of electronic equipment systems. In recent years, the power consumption of modern radar and other electronic equipment has increased sharply, and the high integration and miniaturization of electronic devices has increased the heat flux density of the equipment, which puts forward higher requirements for the heat dissipation capacity of the equipment. [0003] At present, the traditional way of thinking is that when...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/20327H05K7/20509
Inventor 杨国栋
Owner BEIJING INST OF RADIO MEASUREMENT