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Ultrasonic vibration ultra-thin slicing cutter holder

An ultra-thin slicing and ultrasonic vibration technology, applied in sampling, measuring devices, instruments, etc., can solve the problems of high price, limited application fields, single specifications, etc., achieve low price, expand application fields, and improve surface flatness and quality. Effect

Pending Publication Date: 2017-12-29
INSITUTE OF BIOPHYSICS CHINESE ACADEMY OF SCIENCES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the current commercial ultrasonic vibration sectioning diamond knife is an integral structure, which is not only expensive, but also has a single specification, which greatly limits its application fields

Method used

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  • Ultrasonic vibration ultra-thin slicing cutter holder
  • Ultrasonic vibration ultra-thin slicing cutter holder

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Embodiment Construction

[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0026] Such as figure 1 and 2 As shown, an ultrasonic vibrating ultra-thin slicing tool holder includes a base 1, a slicing knife holder 2 and an elastic connecting bridge 3, the base 1 is used to be fixed on the knife table of the slicer; the slicing knife holder 2 is used to connect with the slicing knife 4 Connected with each other, the interior of the slicing tool holder 2 is provided with an ultrasonic piezoelectric vibrating piece 5; one end of the elastic connecting bridge 3 is connected with the base 1, and the other end is connected with the slicing tool holder 2, and the elastic connecting bridge 3 has certain elasticity, which is used for The slicing tool holder 2 is driven by the ultrasonic piezoelectric vibrating piece 5, so that the slicing knife 4 vibrates along the blade direction with the same frequency and amplitude as the u...

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Abstract

The invention discloses an ultrasonic vibration ultra-thin slicing cutter holder. The ultrasonic vibration ultra-thin slicing cutter holder comprises a base, a slicing cutter frame and an elastic connecting bridge; the base is used for being fixed to a cutter table of a slicing machine; the slicing cutter frame is used for being connected with a slicing cutter, and is internally provided with the slicing cutter and an ultrasonic piezoelectric vibrating sheet; and one end of the elastic connecting bridge is connected with the base, and the other end of the elastic connecting bridge is connected with the slicing cutter frame, so that when the slicing cutter frame is driven by the ultrasonic piezoelectric vibrating sheet, the slicing cutter and the ultrasonic piezoelectric vibrating sheet can vibrate at the same frequency and the same amplitude in the direction of a cutting edge. According to the ultrasonic vibration ultra-thin slicing cutter holder, due to the fact that the slicing cutter is installed on the slicing cutter frame provided with the ultrasonic piezoelectric vibrating sheet, the slicing cutter is made to have the ultrasonic vibrating function, and therefore the pressure of the cutting edge of the slicing cutter in the cutting direction of a sample can be reduced, prepared slices can be thinner, the compression effect generated because of mechanical cutting is reduced, meanwhile, the surface flatness and the quality of the slices are also improved, and the tolerance level on the hardness of the sample is widened.

Description

technical field [0001] The invention relates to the field of ultra-thin slice preparation equipment, in particular to an ultrasonic vibration ultra-thin slice knife holder. Background technique [0002] Ultrathin section technology is an important technique for studying ultrastructure in the fields of cell biology, neurobiology, and developmental biology. Ultra-thin section technology is to cut the resin-embedded biological sample into slices with a thickness of 30-200nm, which is convenient for imaging under the electron microscope to obtain high-resolution biological structure information. However, due to the pressure of the blade on the sample during mechanical cutting, the generated slices are compressed to a certain extent in the direction perpendicular to the blade, which deforms the structure of the sample; in addition, the hardness of the resin embedding block also has an impact on the thickness and quality of the slices. big impact. [0003] The emergence of ultra...

Claims

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Application Information

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IPC IPC(8): B26D7/26B26D5/08B26D5/00G01N1/06
CPCG01N1/06B26D5/00B26D5/086B26D7/2614B26D7/2628G01N2001/066
Inventor 季刚李喜霞徐伟孙飞
Owner INSITUTE OF BIOPHYSICS CHINESE ACADEMY OF SCIENCES