Binding agent, application of binding agent, composite product, and preparation method and application of composite product

A technology of composite products and binders, applied in chemical instruments and methods, binder additives, non-polymer binder additives, etc., which can solve problems such as differences in adhesion and airtightness

Active Publication Date: 2018-01-09
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above method is a physical bonding method, and there is still a ce

Method used

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  • Binding agent, application of binding agent, composite product, and preparation method and application of composite product
  • Binding agent, application of binding agent, composite product, and preparation method and application of composite product
  • Binding agent, application of binding agent, composite product, and preparation method and application of composite product

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Embodiment approach

[0020] According to a preferred embodiment of the present invention, the bistriazine thiol compound is prepared according to the following method:

[0021] (1) cyanuric chloride and general formula are NH 2 -R-NH 2 The diamine-based compound is subjected to the first reaction at 0-15°C;

[0022] (2) After the first reaction product is mixed with sodium sulfide and hydrochloric acid, the second reaction is carried out at 0-10° C. and the third reaction is carried out under reflux conditions.

[0023] Concrete reaction process is as follows:

[0024]

[0025] The present invention does not specifically limit the reaction time of each stage in the preparation process of the bistriazine thiol compound. The time for the first reaction is preferably 1-5 hours, more preferably 2-4 hours. The time for the second reaction is preferably 1-3 hours, more preferably 1-2 hours. The time for the third reaction is preferably 2-6 hours, more preferably 3-5 hours.

[0026] According to...

specific Embodiment approach

[0031] According to a specific embodiment of the present invention, the bis-triazine thiol compound is prepared according to the following method:

[0032] (1) In a dry round bottom flask, dissolve cyanuric chloride in an organic solvent (the mass ratio of organic solvent to cyanuric chloride is 8-12:1, preferably 9-11:1), then cool to 0-5°C, preferably cooling to 0-3°C, to obtain a cyanuric chloride solution. Diamine-based compound (the molar ratio of cyanuric chloride to diamine-based compound is 1-5:1, preferably 2-3:1, more preferably 2.2-2.8:1) is slowly added to the above-mentioned cyanuric chloride In the solution, then react at low temperature (0-15°C, preferably 5-13°C) for 1-5h, preferably 2-4h, to form an intermediate, and the by-product is HCl;

[0033] (2) sodium sulfide (Na 2 The mol ratio of S to cyanuric chloride is 1-5:1, preferably 2-4:1, more preferably 2.2-3:1) dissolved in water, slowly add hydrochloric acid aqueous solution (the hydrochloric acid aqueou...

preparation example 1

[0051] This preparation example is used to illustrate the preparation method of the bis-triazine thiol compound having the structure represented by formula (1) provided by the present invention.

[0052] (1) In a dry round bottom flask, dissolve 55.35g (0.3mol) of cyanuric chloride with 498.15g of acetone (the mass ratio of acetone to cyanuric chloride is 9:1), cool to 0°C to obtain three polychloride solution. Slowly add 8.18g (0.136mol) of ethylenediamine (the molar ratio of cyanuric chloride to ethylenediamine is 2.2:1) into the above cyanuric chloride solution, and react at 5°C for 4h to form intermediate A1, The by-product is HCl.

[0053] (2) 51.48g (0.66mol) of Na 2 S(Na 2 The molar ratio of S to cyanuric chloride is 2.2:1) dissolved in water, slowly add 264ml of 2mol / L hydrochloric acid aqueous solution (HCl and Na 2 The molar ratio of S is 0.8:1), then intermediate A1 was added, reacted at 0°C for 2h, and then heated to reflux for 3h. The reaction product was was...

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Abstract

The invention relates to the field of adhesives, and discloses a binding agent, an application of the binding agent, a composite product, and a preparation method and an application of the composite product. The binding agent contains a bis-triazine thiol compound having a structure represented as a formula (I), wherein R is at least one selected from a group consisting of straight-chain or branched alkylene of C1-C16 and arylene-containing chain segments of C6-C16. An organic thin film is formed between a metal layer and a plastic layer by using the binder containing the bis-triazine thiol compound which has the structure represented as the formula (I), wherein the bis-triazine thiol compound having the structure represented as the formula (I) contains a plurality of conjugated thiol functional groups, which can be combined with each other to form the compact organic film, and the excess thiol functional groups can be combined with metals and plastic through chemical bonds, so that the bonding effect is achieved.

Description

technical field [0001] The present invention relates to the field of electronic products, in particular, to a bonding agent, the application of the bonding agent as a bonding agent between metal and plastic, a composite product, a preparation method of a composite product, and the The composite product prepared by the method and the application of the composite product as an electronic product shell. Background technique [0002] At present, in the IT industry, the secondary injection molding technology of metal and plastic has become the mainstream. Among them, the bonding performance between metal and plastic has become the core of the technology. At present, the applicant uses the self-developed PMH (Polymer Metal Hybrid) technology for bonding between metal and plastic, and it has been used in batches well. PMH technology is an emerging molding technology, which puts metal stamping parts into injection molds, and injects polymers on its surface, and combines plastics a...

Claims

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Application Information

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IPC IPC(8): C09J11/06C07D251/46B32B15/04B32B15/08B32B7/10B32B37/12
Inventor 冷世伟林宏业胡文
Owner BYD CO LTD
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