A packaging method for electronic components based on ultrasonic consolidation technology
An electronic component and ultrasonic consolidation technology, applied in the field of additive manufacturing, can solve the problems of difficult metal materials, packaging electronic devices, etc., and achieve the effects of fast packaging speed, low operating temperature, and simple and easy packaging methods.
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Embodiment 1
[0025] In this embodiment, the electronic component packaging method utilizing ultrasonic consolidation technology includes the following steps:
[0026] (a) First, model the parts that need to be packaged with electronic components, and set the position and shape of the grooves for installing electronic components inside the parts.
[0027] (b) Using Autofab software, slice the model obtained in step (a) according to the aluminum alloy thickness of 0.1mm, generate a data file in mtt format, and then transfer the data file to the processing equipment.
[0028] (c) According to the position and shape of the groove where the electronic components are installed inside the part, set the movement track of the cutting knife, set the cutting speed to 100r / min, and set the cutting speed to 1m / min.
[0029] (d) Grind the aluminum alloy with 1500-grit sandpaper, then rinse it with alcohol, and blow it dry. This step is mainly to increase the contact area between the metal strips, and it...
Embodiment 2
[0037] In this embodiment, the electronic component packaging method utilizing ultrasonic consolidation technology includes the following steps:
[0038] (a) First, model the parts that need to be packaged with electronic components, and set the position and shape of the grooves for installing electronic components inside the parts.
[0039] (b) Using Autofab software, slice the model obtained in step (a) according to the thickness of the magnesium alloy of 0.2mm, generate a data file in mtt format, and then transfer the data file to the processing equipment.
[0040] (c) According to the position and shape of the groove where the electronic components are installed inside the part, set the movement track of the cutting knife, set the cutting speed to 100r / min, and set the cutting speed to 1m / min.
[0041] (d) Grinding the magnesium alloy with 1500-grit sandpaper, then rinsing with alcohol, and drying, and drying, this step is mainly to increase the contact area between the me...
Embodiment 3
[0048] In this embodiment, the electronic component packaging method utilizing ultrasonic consolidation technology includes the following steps:
[0049] (a) First, model the parts that need to be packaged with electronic components, and set the position and shape of the grooves for installing electronic components inside the parts.
[0050] (b) Using Autofab software, slice the model obtained in step (a) according to the thickness of the titanium alloy of 0.15 mm, generate a data file in mtt format, and then transfer the data file to the processing equipment.
[0051] (c) According to the position and shape of the groove where the electronic components are installed inside the part, set the movement track of the cutting knife, set the cutting speed to 100r / min, and set the cutting speed to 1m / min.
[0052] (d) Grind the titanium alloy with 1500-grit sandpaper, then rinse it with alcohol, and blow it dry. This step is mainly to increase the contact area between the metal strip...
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