A packaging method for electronic components based on ultrasonic consolidation technology

An electronic component and ultrasonic consolidation technology, applied in the field of additive manufacturing, can solve the problems of difficult metal materials, packaging electronic devices, etc., and achieve the effects of fast packaging speed, low operating temperature, and simple and easy packaging methods.

Active Publication Date: 2020-08-04
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional electronic packaging methods cannot achieve the above requirements, mainly because traditional packaging technology is difficult to package complex electronic devices with metal materials, and if sensors are implanted into armor or aircraft skin, it is often the armor and aircraft skin that are in the process of processing. The armor or skin prepared by this technology should not only meet the higher mechanical performance requirements, but also be implanted with sensor devices.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] In this embodiment, the electronic component packaging method utilizing ultrasonic consolidation technology includes the following steps:

[0026] (a) First, model the parts that need to be packaged with electronic components, and set the position and shape of the grooves for installing electronic components inside the parts.

[0027] (b) Using Autofab software, slice the model obtained in step (a) according to the aluminum alloy thickness of 0.1mm, generate a data file in mtt format, and then transfer the data file to the processing equipment.

[0028] (c) According to the position and shape of the groove where the electronic components are installed inside the part, set the movement track of the cutting knife, set the cutting speed to 100r / min, and set the cutting speed to 1m / min.

[0029] (d) Grind the aluminum alloy with 1500-grit sandpaper, then rinse it with alcohol, and blow it dry. This step is mainly to increase the contact area between the metal strips, and it...

Embodiment 2

[0037] In this embodiment, the electronic component packaging method utilizing ultrasonic consolidation technology includes the following steps:

[0038] (a) First, model the parts that need to be packaged with electronic components, and set the position and shape of the grooves for installing electronic components inside the parts.

[0039] (b) Using Autofab software, slice the model obtained in step (a) according to the thickness of the magnesium alloy of 0.2mm, generate a data file in mtt format, and then transfer the data file to the processing equipment.

[0040] (c) According to the position and shape of the groove where the electronic components are installed inside the part, set the movement track of the cutting knife, set the cutting speed to 100r / min, and set the cutting speed to 1m / min.

[0041] (d) Grinding the magnesium alloy with 1500-grit sandpaper, then rinsing with alcohol, and drying, and drying, this step is mainly to increase the contact area between the me...

Embodiment 3

[0048] In this embodiment, the electronic component packaging method utilizing ultrasonic consolidation technology includes the following steps:

[0049] (a) First, model the parts that need to be packaged with electronic components, and set the position and shape of the grooves for installing electronic components inside the parts.

[0050] (b) Using Autofab software, slice the model obtained in step (a) according to the thickness of the titanium alloy of 0.15 mm, generate a data file in mtt format, and then transfer the data file to the processing equipment.

[0051] (c) According to the position and shape of the groove where the electronic components are installed inside the part, set the movement track of the cutting knife, set the cutting speed to 100r / min, and set the cutting speed to 1m / min.

[0052] (d) Grind the titanium alloy with 1500-grit sandpaper, then rinse it with alcohol, and blow it dry. This step is mainly to increase the contact area between the metal strip...

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Abstract

The invention relates to an electronic component packaging method based on an ultrasonic consolidation technology, which belongs to the technical field of additive manufacturing. The technical problemto be solved is to provide a method of packging an electronic component using an ultrasonic consolidation technology. The technical scheme adopted to solve the technical problem is as follows: metalfoil is consolidated together layer by layer using an ultrasonic consolidation device, and when the height of the metal foil consolidated reaches the bottom of a groove, the current layer of metal foil is cut to form a hole according to the shape of an electronic component; then, the foil with a hole continues to be consolidated layer by layer to form a groove, the electronic component is installed in the groove, and molten resin is added to fix the electronic component; and finally, the metal foil continues to be consolidated layer by layer for sealing, in order to package the electronic component. The electronic component packaging method provided by the invention is simple and easy to implement, is of low cost, and can realize mass production. The electronic component packaging method can be widely used in the field of electronic component packaging.

Description

technical field [0001] The invention relates to a packaging method for electronic components, in particular to a packaging method for electronic components based on ultrasonic consolidation technology, and belongs to the technical field of additive manufacturing. Background technique [0002] With the development of the electronic industry, electronic products are developing in the direction of miniaturization, portability, multi-function, high reliability and low cost. In order to meet the requirements of various electronic products, electronic packaging has developed a variety of packaging technologies, and a large number of new theories, new materials, new processes and new products have emerged. Electronic packaging is working with electronic design and manufacturing to jointly promote the development of an information society. [0003] In the circuit, packaging plays the role of chip protection, chip support, chip heat dissipation, chip insulation and connection betwee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/56
Inventor 赵占勇白培康王宇李晓峰刘斌王建宏李玉新
Owner ZHONGBEI UNIV
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