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FPC (flexible printed circuit)-used epoxy adhesive and preparation method thereof

A technology of epoxy adhesive and epoxy resin, which is applied in the direction of epoxy resin adhesive, adhesive, adhesive additive, etc., can solve the problems of technology and cost, achieve stable performance, improve flame retardant performance, and be easy to cure Effect

Inactive Publication Date: 2018-02-16
ANHUI XINCHEN OPTICAL NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still technical and cost problems in the application process

Method used

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  • FPC (flexible printed circuit)-used epoxy adhesive and preparation method thereof
  • FPC (flexible printed circuit)-used epoxy adhesive and preparation method thereof
  • FPC (flexible printed circuit)-used epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A kind of epoxy adhesive for FPC comprises following weight ratio composition:

[0025]

[0026] Wherein, the composite epoxy resin is a mixture of bisphenol A type E-22 type epoxy resin and bisphenol A type E-54 type epoxy resin with a mass ratio of 1.8:1.

[0027] A kind of preparation method of epoxy adhesive for FPC, concrete steps are as follows:

[0028] 1) Take each component according to the above formula, first refine the toughening agent, add bisphenol A type E-22 type epoxy resin with a weight ratio of 13% in 1 / 3 amount of methyl ethyl ketone solvent, Stir until the bisphenol A type E-22 epoxy resin is completely dissolved. During the stirring process, it can be heated and the temperature is controlled at 45°C to accelerate the complete dissolution of the bisphenol A type E-22 epoxy resin. Then add 1 / 2 amount of composite flame retardant mixed with aluminum hydroxide and phosphorus nitrogen flame retardant with a mass ratio of 1.5:1, 1 / 2 amount of refine...

Embodiment 2

[0032] The preparation method of the epoxy adhesive for FPC in this embodiment is the same as in Example 1, the difference is that an epoxy adhesive for FPC includes the following weight ratio components:

[0033]

[0034] Wherein, the composite epoxy resin is a mixture of bisphenol A type E-22 type epoxy resin and bisphenol A type E-54 type epoxy resin with a mass ratio of 3:1.

Embodiment 3

[0036] The preparation method of the epoxy adhesive for FPC in this embodiment is the same as in Example 1, the difference is that an epoxy adhesive for FPC includes the following weight ratio components:

[0037]

[0038] Wherein, the composite epoxy resin is a mixture of bisphenol A type E-22 type epoxy resin and bisphenol A type E-54 type epoxy resin with a mass ratio of 1:1.

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PUM

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Abstract

The invention discloses an FPC (flexible printed circuit)-used epoxy adhesive and a preparation method thereof, which belong to the technical field of processing of FPCs. The epoxy adhesive comprisesthe following ingredients at weight ratio: 15-25% of composite epoxy resin, 10-15% of a toughening agent, 10-25% of a composite flame retardant, 5-10% of a composite curing agent, 0.1-3% of other additives and the balance of a solvent, wherein the composite epoxy resin is a mixture of bisphenol A E-22 epoxy resin and bisphenol A E-54 epoxy resin at the mass ratio of 1-3:1; the composite flame retardant is a mixture of aluminum hydroxide and a phosphorus-nitrogen flame retardant. Through adoption of the composite epoxy resin, the composite flame retardant and the composite curing agent, the epoxy adhesive has the advantages of overcoming the defect of the property of a pure single component and improving the stability and the curing property, and the subsequent defect rate of the surface ofa composite stiffening plate is reduced.

Description

technical field [0001] The invention belongs to the technical field of flexible circuit board processing, in particular to the field of epoxy cover film adhesives, in particular to an epoxy adhesive for FPC and a preparation method thereof. Background technique [0002] Flexible circuit board is a kind of highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. Referred to as soft board or FPC, it has the characteristics of high wiring density, light weight, and thin thickness. In order to make the flexible circuit board have sufficient support strength when soldering or plugging in and out, the flexible circuit board often needs to be bonded and reinforced in some places as a support body to improve the strength of the plug-in part and facilitate the overall composition of the product. According to different uses, polyimide-based reinforcement boards can be divided into single-layer reinforcement boards and comp...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/08C08G59/50
CPCC09J163/00C08G59/504C08G59/5093C08K2003/2227C08L2201/02C08L2201/08C08L2205/025C08L2205/03C09J11/04C09J11/08C08L63/00C08L13/00C08K3/22
Inventor 周有文周小马胡必刚郑诗友
Owner ANHUI XINCHEN OPTICAL NEW MATERIALS