High-thermal-conductivity, conductive and environment-friendly adhesive and preparation method thereof

Abstract

The invention discloses a high-thermal-conductivity, conductive and environment-friendly adhesive and a preparation method thereof. The adhesive contains the following components: modified epoxy resin, konjak gulcomannan, chitosan, a heat-conducting filling, a conductive filling, a diluent, a curing agent, a curing accelerator and a rheology control agent. By virtue of reasonable raw material selection and formula design, particularly the selection of the heat-conducting filling and the conductive filling, the heat-conducting filling and a conductive multi-walled carbon nanotube are processedby through chemical silvering, the heat-conducting filling and the conductive filling are distributed to partial matrix resin and are mixed to form a mixed component, and the mixed component is mixedwith other matrix components, so that the consistency among the nano-scale heat-conducting filling, the conductive filling and the matrix resin is effectively improved, the dispersion effect is improved, and therefore, the functionality of the adhesive is furthest exerted; and by mixing epoxy resin, konjak gulcomannan and chitosan in use, the performance of the matrix is broadened, and meanwhile,the environmental protection property is improved.

Description

technical field [0001] The invention relates to the field of chemical products, in particular to an environmentally friendly adhesive with high thermal and electrical conductivity. Background technique [0002] Conductive and thermally conductive adhesive is a special conductive polymer composite material that can effectively bond various materials and has electrical and thermal conductivity. The conductive and thermally conductive adhesives on the market are usually composed of conductive and thermally conductive filler materials and polymer resins. . However, due to the aggregation of conductive and thermally conductive fillers, the existing conductive and thermally conductive adhesives have poor filling dispersion performance, which limits the electrical and thermal conductivity, especially the thermal conductivity. The thermal conductivity is usually lower than 2 w / (m·K) , at around 0.2 w / (m·K), the thermal conductivity is low and cannot meet the use requirements. In a...

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Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a high thermal conductivity and electrical conduction environmental protection adhesive and its preparation method, which can solve the above-mentioned problems existing in the existing thermal and electrical conduction adhesives