Dielectric paste for stainless steel thick film circuit and preparation method of dielectric paste

A technology of dielectric slurry and thick film circuit, which is applied in the manufacture of circuits, electrical components, semiconductors/solid devices, etc. It can solve the problems that the dielectric slurry cannot meet the requirements, achieve excellent thixotropy, anti-settling effect, and high insulation resistance , the effect of high breakdown strength

Inactive Publication Date: 2018-02-16
ZHEJIANG ANYANG NEW ENERGY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Among the above-mentioned requirements of dielectric paste, most of the dielectric pastes for thick film circuits based on ceramic substrates cannot meet the requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A preparation method for a dielectric slurry for a stainless steel thick film circuit, the preparation method comprising the steps of:

[0019] A, preparation of glass-ceramic powder: the TiO of 30kg 2 , 1kg of B 2 o 3 , 5kg of AI 2 o 3 , 10kg of BaO, 2kg of H 3 BO 3 , 1kg of ZrO 2 and 1kg of Co 3 o 4 Put it into a mixer and mix it evenly, and then put it into a high-temperature electric furnace for melting. The melting temperature is 1200°C and the holding time is 2 hours. Micro slag, the glass micro slag is put into a ball mill to pulverize, and after the pulverization is completed, a glass-ceramic powder with a particle size not greater than 5 microns is obtained.

[0020] B. Preparation of organic binder: pour 80kg of tributyl citrate, 0.1kg of hydrogenated castor oil, 0.5kg of ethyl cellulose, 0.1kg of terpineol and 0.1kg of lecithin into a power mixer , dissolved at 80°C for several hours to prepare an organic binder.

[0021] C. Preparation of medium s...

Embodiment 2

[0023] A preparation method for a dielectric slurry for a stainless steel thick film circuit, the preparation method comprising the steps of:

[0024] A, preparation of glass-ceramic powder: the TiO of 70kg 2 , 15kg of B 2 o 3 , 30kg of AI 2 o 3 , 40kg of BaO, 20kg of H 3 BO 3 , 10kg of ZrO 2 and 10kg of Co 3 o 4 Put it into a mixer and mix it evenly. After mixing it evenly, put it into a high-temperature electric furnace for melting. The melting temperature is 1600°C and the holding time is 6 hours. After the melting is completed, water extraction is carried out through a planetary ball mill, and the glass is obtained after water crushing. Micro slag, the glass micro slag is put into a ball mill to pulverize, and after the pulverization is completed, a glass-ceramic powder with a particle size not greater than 5 microns is obtained.

[0025] B. Preparation of organic binder: pour 98kg of tributyl citrate, 0.5kg of hydrogenated castor oil, 0.10kg of ethyl cellulose, 0...

Embodiment 3

[0028] A preparation method for a dielectric slurry for a stainless steel thick film circuit, the preparation method comprising the steps of:

[0029] A, preparation of glass-ceramic powder: the TiO of 50kg 2 , 8kg of B 2 o 3 、17kgAI 2 o 3 , 25kg of BaO, 11kg of H 3 BO 3 , 15kg of ZrO 2 and 6kg of Co 3 o 4 Put it into a mixer and mix it evenly, and then put it into a high-temperature electric furnace for melting. The melting temperature is 1400°C and the holding time is 4 hours. After the melting is completed, water extraction is carried out through a planetary ball mill. Micro slag, the glass micro slag is put into a ball mill to pulverize, and after the pulverization is completed, a glass-ceramic powder with a particle size not greater than 5 microns is obtained.

[0030] B, prepare organic binder: pour the tributyl citrate of 89kg, the hydrogenated castor oil of 3kg, the ethyl cellulose of 5kg, the terpineol of 5kg and the lecithin of 2.5kg into the power mixer, at...

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Abstract

The invention discloses dielectric paste for a stainless steel thick film circuit and a preparation method of the dielectric paste. The dielectric paste comprises the following components in percentages by weight: 70-90% of a solid-phase component and 30-10% of an organic binder, wherein the organic binder comprises the following raw materials in percentages by weight: 80-98% of tributyl citrate,0.1-5% of hydrogenated castor oil, 0.5-10% of ethyecellulose, 0.1-10% of terpilenol and 0.1-5% of lecithin. The preparation method comprises the following steps of (A) preparing microcrystalline glasspowder; (B) preparing the organic binder; and (C) preparing the dielectric paste. The dielectric paste is high in puncture strength and good in insulating property, printing and sintering characteristics and environmental protection performance and has excellent thixotropy and anti-settling effect.

Description

technical field [0001] The invention relates to a dielectric slurry and a preparation method thereof, in particular to a dielectric slurry for stainless steel thick film circuits and a preparation method thereof. Background technique [0002] Special stainless steel thick-film circuit components have the characteristics of high power density, high mechanical strength, strong thermal shock resistance, and vibration resistance. Corresponding mechanical and thermal performance requirements are put forward for stainless steel substrates. [0003] Traditional substrate materials such as ceramic materials and polymer materials have good dielectric properties, and a series of electronic pastes that match them have already been commercialized. However, as new special thick-film circuit components, brittle ceramic materials as substrates cannot meet their requirements. Basic use requirements, the most serious problem is that it is fragile during installation and use. Polymer substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B3/08H01B19/00C03C12/00C03C8/24C03C8/02H01L21/02
CPCH01B3/087C03C8/02C03C8/24C03C12/00H01B3/084H01B19/00H01L21/02205
Inventor 吴鹿生谢江西
Owner ZHEJIANG ANYANG NEW ENERGY TECH CO LTD
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