Epoxy resin thermally conductive insulating material and preparation method thereof

A heat-conducting insulating material, epoxy resin technology, applied in the direction of plastic/resin/wax insulators, heat exchange materials, organic insulators, etc., can solve problems such as complex preparation process, achieve simple preparation method, reduce material cost, and excellent insulation The effect of performance features

Active Publication Date: 2019-07-16
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Therefore, the technical problem to be solved by the present invention is to overcome the defects in the prior art that the epoxy resin material with high insulation and thermal conductivity needs to be added with surface-modified inorganic fillers and the preparation process is complicated, so as to provide a A kind of epoxy resin thermally conductive insulating material and preparation method thereof

Method used

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  • Epoxy resin thermally conductive insulating material and preparation method thereof

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Embodiment 1

[0035] This embodiment provides an epoxy resin thermally conductive insulating material, the preparation method of which comprises:

[0036] Mix three kinds of fillers with different particle sizes with a total volume fraction of 35% with bisphenol A epoxy matrix and phthalic anhydride curing agent and heat to 50°C under pressure of 1.3×10 4 Vacuum stirring in Pa environment for 20min, then pouring into the mold, heating and curing at 70°C and 120°C successively, the curing time is 2h and 18h ​​respectively. The three fillers are all boron nitride, the average particle size ratio of the three fillers is 4:1.6:0.8 according to the particle size, the particle number ratio is 1:0.9:2.2 according to the particle size, and the largest average particle size The particle size of the filler was 22 μm.

Embodiment 2

[0038]This embodiment provides an epoxy resin thermally conductive insulating material, the preparation method of which comprises:

[0039] Mix three kinds of fillers with different particle sizes with a total volume fraction of 40% with E51 epoxy matrix and hexahydrophthalic anhydride curing agent, heat to 70°C and press at a pressure of 1.8×10 4 Vacuum stirring under Pa environment for 3 hours, then pouring into the mold, heating and curing at 80°C and 130°C successively, the curing time is 1h and 23h respectively. The three fillers are all mixtures of boron nitride, silicon nitride, and silicon oxide at a volume ratio of 1:1:2, and the average particle diameter ratio of the three fillers is arranged as 4:1.656:1.2 according to particle size, and the particle number ratio The particle size arrangement is 0.98:1:2.03, and the particle size of the filler with the largest average particle size is 18 μm.

Embodiment 3

[0041] This embodiment provides an epoxy resin thermally conductive insulating material, and its preparation method includes:

[0042] Mix three kinds of fillers with different particle sizes with a total volume fraction of 37%, mix with bisphenol F epoxy matrix and methyl hexahydrophthalic anhydride curing agent, heat to 120°C and press at a pressure of 1.7×10 4 Vacuum stirring in Pa environment for 10min, then pouring into the mold, heating and curing at 120°C and 180°C successively, the curing time is 2h and 3h respectively. The three fillers are all mixtures of boron nitride, aluminum nitride, and silicon nitride in a mass ratio of 3:5:1, and the average particle diameter ratio of the three fillers is arranged as 4:1.656:0.9 according to particle size, and the particle number ratio The particle size arrangement is 1.05:1:1.96, and the particle size of the filler with the largest average particle size is 11 μm.

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Abstract

The invention belongs to the technical field of thermally conductive and insulating materials, and particularly relates to an epoxy resin thermally conductive insulating material and a preparation method thereof. The material includes an epoxy resin basic material, inorganic filler and a curing agent, wherein the inorganic filler is composed of fillers of three different particle sizes. The epoxyresin thermally conductive insulating material has excellent thermal conductivity and insulation performance only through selection of the ratio of three different particle size grading of the inorganic filler, the ratio of the use amount of the filler of different particle sizes and the particle sizes, and no surface-modified inorganic filler is needed, so that the material cost is reduced, and the preparation method of the material is simpler. The thermal conductivity of the material can reach 1.25 W.m<-1>.K<-1> at 30 DEG C, the highest thermal conductivity can reach 1.62 W.m<-1>.K<-1>, theresistivity of the material is 2.9x10<16> omega.cm or above below 30 DEG C, and application requirements of power electronic transformers, saturation resistors and other high insulation scenes can bemet fully.

Description

technical field [0001] The invention belongs to the technical field of thermally conductive insulating materials, and in particular relates to an epoxy resin thermally conductive insulating material and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics integration and assembly technology and the higher and higher requirements for high voltage in the field of power and electrical insulation, as well as the rapid development of other related fields, the volume of electronic components and logic circuits has shrunk by tens of millions of times, and With the sharp increase of operating frequency, the heat generated by electronic equipment accumulates rapidly, causing the temperature of the working environment of electronic devices to rise sharply. Therefore, improving the heat dissipation capability has become a research hotspot, and improving the heat dissipation performance of thermally conductive and insulating packagin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/38C08K3/34C08K3/36C08K3/28C08K3/22C09K5/14H01B3/40
CPCC08K3/22C08K3/28C08K3/34C08K3/36C08K3/38C08K2003/2227C08K2003/282C08K2003/385C08K2201/003C09K5/14H01B3/40C08L63/00
Inventor 陈赟张翀杨威张卓尹立颜丙越陈新边凯陶加贵徐晓轶
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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