Printed circuit board assembly and terminal device

Abstract

The present invention provides a printed circuit board assembly and a terminal device, wherein the printed circuit board assembly includes: a first printed circuit board; a radio frequency module arranged on the first printed circuit board; at least one second printed circuit board On the circuit board, at least one first-type functional module is arranged on at least one second printed circuit board, and the second printed circuit board is connected to the first printed circuit board. The printed circuit board assembly provided by the present invention makes the design of the printed circuit board assembly more flexible by separating the radio frequency module and the first type of functional module, and avoids the waste caused by the design of the radio frequency module and the PCB main board on the same board. The design cost is reduced, the loss on the routing of the radio frequency signal is reduced, the development cycle can be shortened, and the influence of noise on the performance of the radio frequency signal can be avoided.

Description

technical field [0001] The present invention relates to the technical field of electronic equipment, in particular to a printed circuit board assembly and terminal equipment. Background technique [0002] Currently, in the design of a printed circuit board (PCB) of a smart phone, a radio frequency module, a processor (Application Processor, AP) module and other functional modules are all located on the same PCB main board. However, with more and more mobile phone functions, the main board of the mobile phone is getting thinner and thinner, which makes the PCB design of the RF module face the following problems: [0003] 1. As the thickness of the PCB becomes thinner, the thickness of the insulating layer and the thickness of the copper of the multi-layer PCB board also decrease accordingly, which makes the high-frequency impedance line of the RF module need a thinner line width to achieve 50 ohm impedance Requirements, however, the too thin line width exceeds the process ca...

AI Technical Summary

Problems solved by technology

[0003] 1. As the thickness of the PCB becomes thinner, the thickness of the insulating layer and the thickness of the copper of the multi-layer PCB board also decrease accordingly, which makes the high-frequency impedance line of the RF module need a thinner line width to achieve 50 ohm impedance Requirements, however, the too thin line width exceeds the process capability of the conventional process, which requires the use of new insulating materials or new process technology, which greatly increases the design cost;

[0004] 2. In the design of the mobile phone PCB motherboard, the radio frequency area needs to be laid out separately from other module

Images