Method for processing conductive metal substrate

Abstract

The invention provides a method for processing a conductive metal substrate. The method includes the steps of cutting, burr removing, adhesive tape pasting, brownification, laminating, primary drilling, copper plating, primary electroplating, image transfer, secondary electroplating, etching, graph inspection, welding prevention, secondary drilling and molding. In the method, two times of drillingoperation is arranged, the forming step of a connecting finger threaded hole is arranged after adhesive tape pasting and welding prevention, the adhesive tape can be effectively prevented from cracking during high-temperature laminating, a PCB outside the connecting finger can be effectively prevented from being processed to be in the threaded hole, since the threaded hole is only used for connection and fixing, and processing of copper plating and the like is not needed, thereby effectively avoiding waste and materials and saving cost; and in addition, two times of electroplating is also arranged, stability, uniformity and conductivity of a copper plating layer can be effectively improved, tin plating is also performed during the second time of electroplating, the copper plating layer can be effectively protected from air corrosion, and thus the service life of the PCB is prolonged.

Description

technical field [0001] The invention relates to the field of PCB board manufacture, and specifically discloses a processing method for a conductive metal substrate. Background technique [0002] PCB (Printed Circuit Board, printed circuit board) has at least one conductive pattern attached to it, and is equipped with holes and grooves to realize the interconnection between electronic components, which is the basis of almost all electronic products. Generally speaking, if there are electronic components in a certain device, they are also integrated on PCBs of various sizes. In addition to fixing various components, the main function of PCB is to provide connection circuits between various components. The conductive metal substrate is the basis of the multilayer PCB board, and each layer of circuit is made on both sides of the conductive metal substrate to form a multilayer PCB board. [0003] The processing methods of traditional conductive metal substrates are: cutting-dri...

AI Technical Summary

Problems solved by technology

There are connecting fingers on the conductive metal substrate. The connecting fingers are used to connect and fix the PCB board in the equipment. Tape is used to protect the connecting fingers and prevent the connecting fingers from being subjected to subsequent electroplating and other processing. Drill the screw holes for the connecting fingers before When the tape is pasted, when the PCB board is pressed at high temperature, due to the residual air in the screw hole, the air in the screw hole expands at high temperature and causes the tape to burst, which affects the protective function of the tape on the connecting fingers; the copper plating layer formed by traditional process electroplating is not enough Uniform and stable, and the conductivity is not good enough