A power chip packaging method and structure
A technology of power chips and packaging methods, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of IGBT device assembly errors, meet the requirements of ensuring error accuracy, simplify the assembly process, and improve heat dissipation. Effect
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Embodiment 1
[0035] This embodiment provides a power chip packaging method, which is suitable for packaging power chips (such as IGBT chips), such as figure 1 As shown, the method includes the following steps:
[0036] S11: Place the first metal spacer 30, the power chip 20 and the second metal spacer 10 in the plastic sealing mold; specifically, as Figure 2A As shown, first the lower gasket (i.e. the first metal gasket 30), the chip (i.e. the power chip 20) and the upper gasket (i.e. the second metal gasket 10) are put into the plastic packaging mold (including the upper and lower plastic packaging molds) in sequence. ), the plastic encapsulation mold is matched with the chip, and in practical application, it can be changed according to the change of the chip and the upper and lower pads, so as to be suitable for various chip packages.
[0037]S12: Heat up the plastic sealing material to turn it into a liquid state; the plastic sealing material is generally in a solid state at room temp...
Embodiment 2
[0049] This embodiment provides a power chip packaging structure, such as image 3 As shown, it includes: a first cover plate 3, a boss is arranged on the first cover plate 3; a power chip sub-module 1, including a plastic package 50 and a first metal gasket 30 arranged in the plastic package 50, a power chip 20 and the second metal gasket 10, the power chip sub-module 1 is set on the boss of the first cover 3; the second cover 2, the second cover 2 is set on the power chip sub-module 1. The traditional silver sheet and insulating frame are omitted, the contact thermal resistance between various components is reduced, and the heat dissipation of the device is improved. Due to the adoption of the plastic encapsulation process, the silver sheet and the insulating frame are omitted, the production process is reduced, the production efficiency is greatly improved, and the production cost of the device is reduced.
[0050] As a preferred solution, when the power chip 20 is an IGBT...
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