Crystalline silicon diffusion process for realizing deep-junction and low-surface concentration
A diffusion process and crystalline silicon technology, applied in the fields of semiconductor devices, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc. Uniformity and other problems, to achieve the effect of improving and repairing surface damage, improving overall uniformity and surface damage
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Embodiment 1
[0074] This embodiment provides a crystalline silicon diffusion process to realize deep junction and low surface concentration. The diffusion process is to dope crystalline silicon in a diffusion furnace, including the following process: gas charging—constant pressure—boat release—heating process—constant temperature Process—oxidation—prediffusion—heating distribution—the first constant temperature distribution—diffusion—the second constant temperature distribution—cooling—reinflation—taking the boat, where:
[0075] (1) inflatable
[0076] Inflate the quartz boat of the diffusion furnace, the inflation time is 60s, the temperature in the furnace is 750°C, the small nitrogen flow rate and dry oxygen flow rate are 0ml / min, and the maximum nitrogen flow rate is 3000ml / min;
[0077] (2) Constant pressure
[0078] Keep the constant pressure in the furnace, the constant pressure time is 20s, the temperature in the furnace is 750°C, the small nitrogen flow and dry oxygen flow are 0...
Embodiment 2
[0106] This embodiment provides a crystalline silicon diffusion process to realize deep junction and low surface concentration. The diffusion process is to dope crystalline silicon in a diffusion furnace, including the following process: gas charging—constant pressure—boat release—heating process—constant temperature Process—oxidation—prediffusion—heating distribution—the first constant temperature distribution—diffusion—the second constant temperature distribution—cooling—reinflation—taking the boat, where:
[0107] (1) inflatable
[0108] Inflate the quartz boat of the diffusion furnace, the inflation time is 60s, the temperature in the furnace is 750°C, the small nitrogen flow rate and dry oxygen flow rate are 0ml / min, and the maximum nitrogen flow rate is 3000ml / min;
[0109] (2) Constant pressure
[0110] Keep the constant pressure in the furnace, the constant pressure time is 20s, the temperature in the furnace is 750°C, the small nitrogen flow and dry oxygen flow are 0...
Embodiment 3
[0138] This embodiment provides a crystalline silicon diffusion process to realize deep junction and low surface concentration. The diffusion process is to dope crystalline silicon in a diffusion furnace, including the following process: gas charging—constant pressure—boat release—heating process—constant temperature Process—oxidation—prediffusion—heating distribution—the first constant temperature distribution—diffusion—the second constant temperature distribution—cooling—reinflation—taking the boat, where:
[0139] (1) inflatable
[0140] Inflate the quartz boat of the diffusion furnace, the inflation time is 60s, the temperature in the furnace is 750°C, the small nitrogen flow rate and dry oxygen flow rate are 0ml / min, and the maximum nitrogen flow rate is 3000ml / min;
[0141] (2) Constant pressure
[0142] Keep the constant pressure in the furnace, the constant pressure time is 20s, the temperature in the furnace is 750°C, the small nitrogen flow and dry oxygen flow are 0...
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