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Machining method for target material

A processing method and target material technology, applied in metal processing equipment, manufacturing tools, turning equipment, etc., can solve the problems of low processing efficiency, achieve the effects of improving processing efficiency, reducing the number of times of tool setting, and reducing the number of times of changing tools

Inactive Publication Date: 2018-03-13
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the existing mechanical processing technology has low processing efficiency for targets with V-shaped grooves on the sputtering surface.

Method used

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  • Machining method for target material
  • Machining method for target material
  • Machining method for target material

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Experimental program
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Embodiment Construction

[0031] It can be seen from the background art that the target material processing method in the prior art has the problem of low processing efficiency. Now combined with the processing process of the target with V-shaped grooves on the sputtering surface in the prior art, the reasons for its low processing efficiency are analyzed:

[0032] refer to figure 1 , showing a schematic cross-sectional structure of a sputtering surface with a V-groove target.

[0033] Such as figure 1 As shown, the target 10 has a sputtering surface 11, and a plurality of V-shaped grooves 12 are opened on the sputtering surface 11; the V-shaped grooves 12 have two side walls 12a oppositely arranged, and the two side walls 12a are connected at the bottom of the V-shaped grooves to form a "V" shape.

[0034] combined reference figure 2 ,show figure 1 Schematic diagram of the structure of the target processing method shown.

[0035] processing figure 1 For the target material shown, the V-shaped ...

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Abstract

The invention discloses a machining method for a target material. The machining method comprises the following steps: providing the target material, wherein the target material is provided with a surface to be machined; providing a tool, wherein the tool comprises a blade, and a chip discharge groove is formed in the blade; carrying out turning machining on the surface to be machined by adopting the tool to form a sputtering surface, wherein the waste chips generated in the turning process are discharged through the chip discharge groove in the blade. According to the technical scheme of the invention, in the turning process, the generated waste chips can be discharged through the chip discharge groove in the blade; and therefore, the heat generated in the turning process can be timely dissipated, improvement for the heat dissipation capacity of the adopted tool is improved, heat accumulation is reduced, lowering for the temperature of the tool in the turning process is improved, and reduction for the wear of the blade is improved, so that replacement times for the tool is reduced, and increasing for the machining efficiency is improved. In addition, in a machining process for thesputtering surface of the target material, tool setting times after tool replacement can also be reduced due to the reduction of the replacement times for the tool, so that increasing for process efficiency is also improved.

Description

technical field [0001] The invention relates to the field of target material manufacturing, in particular to a target material processing method. Background technique [0002] Magnetron sputtering is a coating process that uses charged particles to bombard the target, causing the target atoms to overflow from the surface and evenly deposit on the substrate. Magnetron sputtering has the advantages of high sputtering rate, low substrate temperature, good bonding force between substrate and film, and excellent film uniformity. Magnetron sputtering technology has been widely used in the manufacturing process of electronic and information industries such as integrated circuits, information storage devices, liquid crystal displays, laser memories, and electronic control devices. [0003] With the rapid development of the electronics industry, for example, in the manufacturing process of integrated circuits, the size of chip substrates continues to increase, while the size of elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23B5/00C23C14/35
CPCB23B5/00C23C14/3407C23C14/35
Inventor 姚力军潘杰相原俊夫王学泽吴发游
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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