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A method for pcb chemical nickel gold

A chemical nickel-gold and PCB board technology, applied in the field of PCB chemical nickel-gold, can solve the problems of reduced coating uniformity, strong solder resist attack, high processing requirements, etc., to increase the activation performance of the copper surface, eliminate negative effects, and uniformity Enhanced effect

Active Publication Date: 2019-12-20
GUANGDONG SKYCHEM TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the residue of solder resist ink will adversely affect the subsequent electroless nickel. The following problems mainly exist in the traditional process: (1) The electroless nickel chemical method is highly aggressive to solder resist and requires high pre-treatment of solder resist ; (2) The negative impact of the solder mask on the electroless nickel method, including skip plating or skip plating (skip plating), step plating (step plating), and reduced plating uniformity; The problem is generally improved by adding a sulfur-containing plating starter to the formula, but the cracking products of the sulfur-containing plating starter in this improvement plan will be co-deposited in the nickel coating, leaving hidden dangers and risks of black nickel (blacknickel), reduce the reliability of the method
[0008] Although the above method can solve the problems existing in the traditional process of some PCB chemical nickel and gold to a certain extent, it cannot fundamentally solve the above problems, so it is necessary to develop a new method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) Degrease the etched PCB board in 100ml / L degreaser working solution at 40°C for 5 minutes, then wash it with hot water at 50°C for 3 minutes; then use 100g / L sodium persulfate and 20ml / L L of 98% sulfuric acid working solution, at 25 ° C for 1.5 minutes; after micro etching, wash with pure water for 2 minutes, then use 50ml / L activator and 50ml / L 98% sulfuric acid working solution, at 26 ° C Activation at high temperature for 2 minutes; wash with pure water for 1 minute, then soak with 50ml / L 98% sulfuric acid, and continue to wash with pure water for 1 minute;

[0032] (2) Put the above-mentioned pretreated PCB board in the working solution of the nickel cylinder, and the whole board is electroless with nickel at 88°C for 25 minutes, and the working solution of the nickel cylinder contains 4.8g / L Ni 2+ , 28g / L sodium hypophosphite and a small amount of stabilizers and other complexing agents, the pH of the working solution is 4.8;

[0033] (3) After the electroles...

Embodiment 2

[0037] (1) Degrease the etched PCB board in 100ml / L degreaser working solution at 40°C for 5 minutes, then wash it with hot water at 50°C for 3 minutes; then use 100g / L sodium persulfate and 20ml / L L of 98% sulfuric acid working solution, at 25 ° C for 1.5 minutes; after micro etching, wash with pure water for 2 minutes, then use 50ml / L activator and 50ml / L 98% sulfuric acid working solution, at 26 ° C Activation at high temperature for 2 minutes; wash with pure water for 1 minute, then soak with 50ml / L 98% sulfuric acid, and continue to wash with pure water for 1 minute;

[0038] (2) Place the above pretreated PCB board in the working fluid of the nickel cylinder, and electroless nickel on the whole board at 85°C for 50 minutes, and the working fluid of the nickel cylinder contains 5.0g / L Ni 2+ , 25g / L sodium hypophosphite and a small amount of stabilizers and other complexing agents, the pH of the working solution is 4.5;

[0039] (3) After the electroless nickel on the whole...

Embodiment 3

[0043] (1) Degrease the etched PCB board in 100ml / L degreaser working solution at 40°C for 5 minutes, then wash it with hot water at 50°C for 3 minutes; then use 100g / L sodium persulfate and 20ml / L L of 98% sulfuric acid working solution, at 25 ° C for 1.5 minutes; after micro etching, wash with pure water for 2 minutes, then use 50ml / L activator and 50ml / L 98% sulfuric acid working solution, at 26 ° C Activation at high temperature for 2 minutes; wash with pure water for 1 minute, then soak with 50ml / L 98% sulfuric acid, and continue to wash with pure water for 1 minute;

[0044] (2) Put the above-mentioned pretreated PCB board in the working solution of the nickel cylinder, and the whole board is electroless with nickel at 90°C for 20 minutes, and the working solution of the nickel cylinder contains 4.5g / L Ni 2+ , 30g / L sodium hypophosphite and a small amount of stabilizers and other complexing agents, the pH of the working solution is 5.0;

[0045] (3) After the electroles...

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PUM

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Abstract

The invention relates to a method for chemical nickel plating and gold immersing of a printed circuit board (PCB). The method comprises the following steps that the PCB is pretreated; then full-boardelectroless chemical nickel plating is conducted; and the PCB subjected to nickel plating is subjected to solder resist ink treatment and then gold chemical replacement. Solder resist ink treatment isconducted after chemical nickel plating, during chemical nickel plating, a plating starting agent is not used, any sulfur-containing additive does not exist, and thus the black nickel quality problemcannot be generated; the influence of a solder resist ink layer is avoided, the activation performance of the copper surface is improved, the uniformity of a nickel coating is greatly improved, the quality problems of skip plating or plating leakage, step plating, thin shoulder and the like are avoided, and the quality defects, caused by solder resist method residual, of chemical nickel plating are also avoided; and meanwhile, the attack of an electroless nickel groove on solder resisting is eliminated, the method is suitable for industrial production, and good application prospects are achieved.

Description

technical field [0001] The invention relates to the field of surface treatment of printed circuit boards, in particular to a PCB chemical nickel-gold method. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. [0003] Electroless nickel gold is also called chemical nickel gold, immersion nickel gold or electroless nickel gold. Electroless nickel gold replaces palladium on the surface of copper through chemical reaction and then electrolessly coats a layer of nickel-phosphorus alloy on the basis of palladium core, and then A layer of gold is plated on the surface of nickel by displacement reaction. At present, there are two methods for the immersion gold of nickel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/16C23C18/18C23C18/32C23C18/42
CPCC23C18/1653C23C18/1803C23C18/32C23C18/42
Inventor 易均云章晓冬刘江波童茂军
Owner GUANGDONG SKYCHEM TECH LTD
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