Surface heat sink of micro-nano composite structure and heat transfer enhancement method of surface heat sink

Abstract

The invention discloses a surface heat sink of a micro-nano composite structure and a heat transfer enhancement method of the surface heat sink, is used in the field of large power electronic integrated device heat exchanging, and solves the cooling problem of high heat flow density. The surface heat sink of the micro-nano composite structure comprises a micro groove group heat sink and a nanometer coating; the nanometer coating is generated on the surface of the micro groove group heat sink; a surface material of the micro groove group heat sink is a semiconductor, glass, ceramic or metal andan alloy of the metal; the micro groove cross section of the micro groove group heat sink is rectangular, trapezoidal or triangular; and a material of the nanometer coating is metal, a metal oxide, metal fluoride, a semiconductor material or organic high polymer paint. According to the surface heat sink of the micro-nano composite structure, the heat exchanging performance of the surface of the micro groove group heat sink is reinforced, and meanwhile, by means of the surface expanding and capillary acting force factors of the micro groove group structure, the phase changing heat exchanging capacity of the heat sink is improved.

Description

technical field [0001] The invention relates to the technical field of thermal energy engineering, in particular to a heat sink of a high-power electronic integrated device and a method for enhancing heat exchange thereof. Background technique [0002] With the development of high technology, the operating power of high-power electronic integrated devices including various computing processing chips, laser devices, high-power LED lamps, etc. is increasing. Among them, while these energy-consuming components exert effective power, a considerable part of the electric power is converted into heat, and the generation of heat will be accompanied by the temperature rise of these high-power electronic devices. However, high temperature is very detrimental to the operation of these high-power electronic devices. For example, if a high-power LED lamp does not add any heat sink, it will burn out after being powered on for a few seconds; the central processing unit (CPU) of a computer ...

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Problems solved by technology

[0005] In view of the above-mentioned shortcomings in the prior art, the present invention provides a surface heat sink with a micro-nano composite structure and a method for enhancing heat transfer. Based on the basic principle of phase transformation heat at the micro-nano scale, the heat transfer capacity of the heat sink is improved. , so that the part of the electric energy converted into heat is quickly taken away from the high-temperature heat source in the form of liquid working fluid phase change, and finally lost to air and other media, greatly reducing the final medium (mainly air) from heat source to heat dissipation The intermediate thermal resistance is removed, which fundamentally solves the problem of high operating temperature of heating functional components

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