Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Disassembling tool and disassembling method of chip pins

A technology for dismantling tooling and pins, applied in auxiliary devices, metal processing, manufacturing tools, etc., can solve problems such as difficult to complete unsoldering operations, short heating time, aging of printed boards, etc., to achieve lightweight, material saving, The effect of easy operation

Inactive Publication Date: 2018-04-06
XIAN AEROSPACE PRECISION ELECTROMECHANICAL INST
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A DIP chip is usually composed of 4 to 20 tube legs. The operation can be completed by soldering the pins one by one during soldering, and all the tube legs must be melted at the same time to be removed smoothly during desoldering. Due to the chip itself, the pad and the printed board The limitation of heat resistance makes it difficult to complete the desoldering operation. If the heating time is long, the chip may be burned, the pads may fall off, and the printed board is aging. However, if the heating time is short, all the tube legs cannot be completely melted to complete the desoldering operation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Disassembling tool and disassembling method of chip pins
  • Disassembling tool and disassembling method of chip pins
  • Disassembling tool and disassembling method of chip pins

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Such as figure 1 with figure 2 As shown, the present invention provides a simple, convenient and practical disassembly tool for chip pins, the basic structure of which is:

[0035] Including heat transfer rod 1, working platform 2, heating tank body 3, heat conduction medium;

[0036] One end of the heat transfer rod 1 is connected to an external heat source, and the other end is installed with a working platform 2;

[0037] The working platform 2 is equipped with a heating tank body 3, and the heating tank body 3 is filled with a heat-conducting medium.

[0038] Wherein, in order to better melt the pins, the heating tank 3 is V-shaped.

[0039] Wherein, the heat conduction medium is solder or heat conduction silica gel, preferably heat conduction silica gel. Thermally conductive silicone grease is the most widely used thermally conductive medium at present. It is an ester-like substance formed after heating, depressurizing, grinding and other processes with silico...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of unsoldering, and particularly relates to a disassembling tool and disassembling method of chip pins. The disassembling tool is simple in structure, convenient and practical. The tool comprises a heat transfer rod, a working platform, heating tank bodies and heat conduction media, wherein one end of the heat transfer rod is connected with an externalsoldering iron, and the other end of the heat transfer rod is provided with the working platform; and the working platform is provided with the heating tank bodies, and the heating tank bodies are filled with the heat conduction media. According to the disassembling tool, soldering tin on the to-be-disassembled chip pins is melted through the heat conduction media in the heating tank bodies, so that the unsoldering operation is completed.

Description

technical field [0001] The invention belongs to the technical field of desoldering, and in particular relates to a chip pin disassembly tool and a disassembly method thereof. Background technique [0002] IC - integrated circuit (integrated circuit) is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , to become a microstructure with the required circuit functions. With the development of the electronics industry, the utilization rate of IC is getting higher and higher. Among them, DIP is the abbreviation of dual inline-pinpackage, that is, dual inline package, which is IC plug-in package. One of the package types, which is suitable for PCB (printed circuit board) through-hole installation and easy to operate. [0003] In...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00B23K3/08B23K1/018
CPCB23K1/018B23K3/00B23K3/08
Inventor 谢宗晟李吉兴曹宽
Owner XIAN AEROSPACE PRECISION ELECTROMECHANICAL INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com