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Support system-level integrated circuit chip

A technology for integrated circuits, supporting systems, applied in the direction of memory systems, logic circuits using specific components, logic circuits using basic logic circuit components, etc.

Active Publication Date: 2018-04-06
GOWIN SEMICON CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Circuits in fixed logic devices are permanent, they perform a function or set of functions, and cannot be changed once fabricated

Method used

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  • Support system-level integrated circuit chip

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Embodiment Construction

[0016] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0017] In order to illustrate the technical solutions of the present invention, specific examples are used below to illustrate.

[0018] figure 1 A module structure supporting a system-level integrated circuit chip of the present invention is shown. For ease of description, only the parts related to this embodiment are shown. The details are as follows. The integrated circuit chip includes a fixed logic module 10 and a programmable logic module. 20;

[0019] The fixed logic module 10 includes a central processing unit module 101, a non-volatile memory module 102, a high-speed data transmission mo...

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Abstract

The invention discloses a support system-level integrated circuit chip. The integrated circuit chip includes a fixed logic module and a programmable logic module. The fixed logic module includes a central processor module, a non-volatile memory module, a high-speed data transmission module and an analog-to-digital conversion and / or digital-to-analog conversion module. The programmable logic moduleincludes a user-defined field programmable logic array and a programming control module. The central processor module is connected with the user-defined field programmable logic array and the programming control module. A non-volatile memory is connected with the user-defined field programmable logic array and the programming control module. The analog-to-digital conversion and / or digital-to-analog conversion module is connected with the user-defined field programmable logic array. The high-speed data transmission module is connected with the user-defined field programmable logic array. According to the support system-level integrated circuit chip, the problems of how to enable different devices to be combined with each other and how to enable the data processing capability to be applicable to access on different application occasions are solved.

Description

technical field [0001] The invention belongs to the field of integrated circuit design, in particular to a supporting system-level integrated circuit chip. Background technique [0002] With the wide application of large-scale integrated circuit technology, more and more application fields and the need to combine the large-scale comprehensive data processing functions of the central processing unit and the superpower of programmable logic devices for different applications, thus forming a variety of SOC (English full name: System on Chip, Chinese full name: system-level integrated circuit chip) with different functions to solve the problem. [0003] The so-called central processing unit can complete operations such as fetching instructions, executing instructions, and exchanging information with external memory and logic components. It is the computing control part of the microcomputer. [0004] The so-called logic devices can be divided into fixed logic devices and program...

Claims

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Application Information

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IPC IPC(8): G06F15/78
CPCG06F15/7807G06F15/7867G06F13/12H03K19/177G06F13/102G06F2212/205G06F12/0638G06F13/4282
Inventor 朱璟辉高三达高彤军蒂瓦卡·乔珀拉陈建光宋宁
Owner GOWIN SEMICON CORP LTD