Microstrip and substrate integrated waveguide-based dual-frequency band-pass filter and design method thereof

A substrate-integrated waveguide and band-pass filter technology, applied in waveguide-type devices, electrical components, circuits, etc., can solve the problems of limited frequency ratio and inability to meet, and achieve low pass-band insertion loss, low cost, and easy integration. Effect

Active Publication Date: 2018-04-20
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, SIW-based dual-band filters also have the problem of limited frequency ratio, which cannot meet the requirements of next-generation systems

Method used

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  • Microstrip and substrate integrated waveguide-based dual-frequency band-pass filter and design method thereof
  • Microstrip and substrate integrated waveguide-based dual-frequency band-pass filter and design method thereof
  • Microstrip and substrate integrated waveguide-based dual-frequency band-pass filter and design method thereof

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Embodiment 1

[0034] Such as Figure 1-2 As shown, a dual-band bandpass filter based on microstrip and substrate integrated waveguide includes a microstrip structure 101 arranged in sequence from top to bottom, a first dielectric substrate 102, a common metal formation 103, and a hollowed-out dielectric substrate 104, a metal plane 105, a second dielectric substrate 106; wherein, the microstrip structure 101 is provided with an ultra-wide stopband microwave bandpass filter 200 based on a step impedance resonator, and the common metal ground 103 is provided with two The arc-shaped gap of the microwave and millimeter wave filter, the dielectric substrate 104 hollowed out in the center is provided with a millimeter wave bandpass filter 300 based on an air-filled substrate integrated waveguide circular cavity; the step impedance resonator The ultra-wide stopband microwave bandpass filter 200 is composed of a hybrid step impedance unit, a first metallized via hole and a loaded open stub; the mil...

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PUM

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Abstract

The invention provides a microstrip and substrate integrated waveguide-based dual-frequency band-pass filter and a design method thereof. The filter comprises two coupled gaps positioned in a signal input end and a signal output end respectively, a phase step impedance resonator-based three-order low-pass filter, a 1/4 wavelength phase step impedance resonator-based two-order band-pass filter, a section of embedded open circuit stub, three air filled and connected circular cavities, a plurality of metalized via holes distributed in the edges of the circular cavities, a three-layer dielectric substrate, a layer of shared metal ground and a layer of bottom surface metal cover plate. The low-pass filter can realize the frequency response characteristic complementary with the band-pass filterby adjusting lengths of high and low impedances, thereby realizing the microwave band-pass filter based on an ultra-wide stop band; and then by combination with a substrate integrated waveguide circular cavity-based millimeter wave band-pass filter with low-frequency cut-off characteristics, the dual-frequency band-pass filter with ultra-high transmission band ratio is further realized.

Description

technical field [0001] The invention relates to the field of wireless communication, more specifically, to a dual-frequency bandpass filter based on microstrip and substrate integrated waveguide and a design method thereof. Background technique [0002] With the continuous increase of data transmission rate requirements in wireless communication systems, technologies such as MIMO and carrier aggregation working in the microwave frequency band have emerged as the times require. However, the ever-expanding huge amount of information and the crowded microwave frequency band inevitably push the next-generation wireless communication frequency band to the millimeter-wave frequency band with sufficient spectrum resources, which means that dual-frequency components covering microwave and millimeter-wave frequency bands will be the next generation. An important part of a generation of wireless communication systems. Taking 2.4GHz and 30GHz as an example, the frequency ratio is as h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/203H01P1/207
Inventor 郑少勇苏志立夏明华
Owner SUN YAT SEN UNIV
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