Ring body forming method for miniature conductive ring suitable for electrodeposition process
A conductive ring and electrodeposition technology, applied in applications, household appliances, household components, etc., can solve the problems of large ring spacing error, poor ring body strength, and difficult molding, etc., achieve short production cycle, solve ring body strength difference, The effect of improving work efficiency
Active Publication Date: 2020-11-06
SHAANXI BAOCHENG AVIATION INSTR
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Problems solved by technology
[0003] The technical problem solved by the present invention is to provide a method for forming a micro-conductive ring body suitable for electrodeposition process manufacturing. The present invention solves the problems of the traditional micro-conductive ring body manufacturing process by injecting and molding the micro-conductive ring body. Poor strength of the ring body, large ring spacing error, difficult to form, large deformation and other problems, meet the use requirements of the miniature conductive ring after the diameter is greatly compressed, improve the structural strength and product reliability of the miniature conductive ring, ensure product quality, and reduce scrapping High efficiency, short production cycle, improved work efficiency, and can meet the requirements of mass production of miniature conductive rings
Method used
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Embodiment Construction
[0015] Attached below figure 1 Embodiments of the present invention are described.
[0016] A method for forming a miniature conductive ring suitable for electrodeposition process, comprising the following steps:
[0017] Step 1: Check the alignment of multiple lead wires 2, so that each lead wire 2 cannot have wrinkles, and the insulation layer of the lead wire 2 cannot be damaged;
[0018] Step 2: Open the plastic pressing mold used to form the miniature conductive ring body, and arrange the multiple lead wires 2 that have been checked and aligned in step 1 into corresponding multiple wire slots in the plastic pressing mold, and the wire slots are According to the number of multiple lead wires 2, they are arranged in two rows at 180° according to the odd number and the even number. fixed;
[0019] Step 3: Clamp the plastic compression mold described in step 2, and use a raw material injection machine to inject the raw material for forming a miniature conductive ring body ...
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Provide a method for forming a miniature conductive ring body suitable for electrodeposition process manufacturing. First, check the alignment of multiple lead wires, arrange the multiple lead wires in corresponding multiple wire grooves in the plastic compression mold, and perform positioning and fixing; After closing the mold, use the raw material injection machine to inject raw materials into the cavity of the plastic compression mold, and form a miniature conductive ring after cooling under pressure. Take out the micro conductive ring formed by plastic compression and inspect its appearance and insulation performance. The invention solves the problems of poor ring body strength, large ring spacing error, difficult molding, and large deformation existing in the traditional miniature conductive ring ring body manufacturing process by injection molding and compression molding, and satisfies the large diameter of the miniature conductive ring. The use requirements after compression can improve the structural strength and product reliability of the miniature conductive ring, ensure product quality, reduce the scrap rate, shorten the production cycle, improve work efficiency, and can meet the requirements of mass production of the miniature conductive ring.
Description
technical field [0001] The invention belongs to the technical field of miniature power transmission devices, and in particular relates to a method for forming a miniature conductive ring suitable for electrodeposition manufacturing. Background technique [0002] Power transmission devices can be divided into large power transmission devices, medium power transmission devices, small power transmission devices and micro power transmission devices in terms of volume. Micro power transmission device (also known as conductive slip ring, collector ring) is a precision mechanical device that transmits current and electrical signals between two relatively rotating structures. , instruments, medical and testing equipment and other fields are widely used. The micro power transmission device is small in size, large in length-to-diameter ratio, high in precision, and compact in structure. It is suitable for precision electromechanical equipment in industries such as aviation, aerospace...
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IPC IPC(8): B29C45/14B29L31/34
CPCB29C45/14B29L2031/34
Inventor 付丙申
Owner SHAANXI BAOCHENG AVIATION INSTR