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A kind of SIC thermopile type high temperature heat flow sensor and preparation method thereof

A heat flow sensor and thermopile technology, which is applied in the manufacture/processing of thermoelectric devices, thermoelectric devices, thermoelectric device junction lead-out materials, etc., to achieve strong controllability, fast response speed, and reduce material costs.

Active Publication Date: 2019-12-17
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, SiC-based high-temperature micro-heaters and flow sensors have been developed, but SiC-based high-temperature heat flow sensors have not been reported yet.

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  • A kind of SIC thermopile type high temperature heat flow sensor and preparation method thereof
  • A kind of SIC thermopile type high temperature heat flow sensor and preparation method thereof
  • A kind of SIC thermopile type high temperature heat flow sensor and preparation method thereof

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Embodiment Construction

[0072] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0073] It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic ideas of the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the compo...

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Abstract

The present invention provides a SiC thermopile type high-temperature heat flow sensor and a preparation method thereof, comprising: a silicon substrate having a first surface and a second surface, a groove is provided on the first surface and a platform area is formed surrounded by the groove The composite dielectric film covers the groove and the platform area; the thermal insulation cavity is set in the silicon substrate, recessed inward from the second surface, and is located under part of the composite dielectric film in the platform area; the P-type SiC thin film resistance block and N-type SiC thin film resistance block, located on the composite dielectric film at the platform area, and partially above the heat insulation cavity; insulating dielectric layer, covering P-type SiC thin film resistance block, N-type SiC thin film resistance block and composite dielectric film; metal The layer is formed on the insulating medium layer, including electrodes and leads, and connects the P-type SiC thin-film resistance block and the N-type SiC thin-film resistance block to form a thermopile. The invention adopts single-crystal SiC with excellent high-temperature performance as a thermoelectric material, and can realize rapid and accurate measurement of heat flux density in high-temperature harsh environments.

Description

technical field [0001] The invention belongs to the technical field of heat flow detection, in particular to a SiC thermopile type high-temperature heat flow sensor and a preparation method thereof. Background technique [0002] In nature and in the production process, there are a lot of heat transfer problems. With the development of modern science and technology, it is far from enough to only use temperature as the only information for heat transfer. Therefore, more and more attention has been paid to the theory and technology of heat flow detection, and the corresponding heat flow sensors have also been greatly developed and widely used. [0003] Although the existing heat flow sensors can meet the general measurement needs of heat flux density in industrial and agricultural production and daily life, their heat resistance temperature and measurement range are generally low, usually at 1000°C and 1MW / m 2 Below, and its size is larger, the response time is longer, and th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L35/22H01L35/32H01L35/34H10N10/855H10N10/01H10N10/17
CPCH10N10/855H10N19/101H10N10/01
Inventor 李铁田伟王跃林
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI