Electronic module

Abstract

An electronic module comprises: a first substrate, an electronic element arranged on the first substrate and electrically connected with the first substrate, a package layer formed on the first substrate and coating the electronic element, a second substrate arranged on the package layer, a shield substrate arranged at the lower surface of the second substrate, and an antenna structure arranged atthe upper surface of the second substrate. The shield structure and the antenna structure are arranged at different planes to allow the antenna structure to emit signals from each direction to improve the radiation efficiency of the antenna.

Description

technical field [0001] The invention relates to an electronic module, especially an electronic module with an antenna. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. [0003] At present, wireless communication technology has been widely used in various consumer electronic products to facilitate receiving or sending various wireless signals. At the same time, in order to meet the design requirements of consumer electronic products, the manufacture and design of wireless communication modules are becoming lighter, Thin, short, and small requirements for development, among which, the planar antenna (Patch Antenna) is widely used in mobile phones (cell phone), personal digital assistant (Personal Digital Assistant, PDA) because of its small size, light weight and easy manufacturing. In the wireless communication module of electronic product...

AI Technical Summary

Problems solved by technology

[0005] Only, in the existing wireless communication module 1, the antenna 15 and the shielding structure 14 are arranged on the same horizontal plane (the upper surface 11a of the substrate 11), so that the antenna 15 cannot be seen from the obliquely above the shielding structure 14 (such as figure 1 The indicated arrow direction A) sends out signals, resulting in poor radiation efficiency of the antenna 15

[0006] In addition, the antenna 15 is planar, so it is necessary to increase the layout area on the surface of the substrate 11, which makes it difficult to reduce the size of the substrate 11, and thus cannot effectively reduce the size of the wireless communication module 1, resulting in that the wireless communication module 1 cannot Meet the needs of miniaturization

[0007] Also, in order to isolate the antenna 15 from the semiconductor chip 10, the shielding wall 14a of the shielding structure 14 needs to be customized inside the packaging layer 13 according to the wiring design and packaging size, and splash on the outer surface of the packaging layer 13. The metal layer 14b of the shielding structure 14 is plated (sputtered) with a layer of 3 to 5 microns (um), so that the manufacturing cost of the shielding structure 14 is greatly increased, and the joint between the shielding wall 14a and the metal layer 14b needs to be packaged and repaired. (molding compound trimming) makes the process very complicated

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