Latex composition for dip-molding and dip-molded article prepared therefrom
A technology of dipping molding and composition, applied in the direction of carboxyl rubber coating, coating, etc., can solve the problems of water loss, increased glove defect rate, glove stickiness, etc., and achieve low viscosity, increase syneresis time, and excellent tensile strength Effect
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Embodiment 1
[0113] Embodiment 1: The latex composition that is used for dip molding and the preparation of dip molding article
[0114] (Preparation of Carboxylic Acid Modified Nitrile Copolymer Latex)
[0115] A 10L high-pressure reactor equipped with a stirrer, a thermometer, a cooler and a nitrogen inlet and suitable for continuous addition of monomers, emulsifiers and polymerization initiators was replaced with nitrogen, and 3 parts by weight of sodium alkylbenzenesulfonate, 0.1 parts by weight of Parts (solid content) of potassium alkenyl succinate (Latemul ASK, dipotassium C16-18 alkenyl succinate, prepared by KAO, Japan), 0.5 parts by weight of tert-dodecyl mercaptan and 140 parts by weight of ion exchange Water was added to 100 parts by weight of a monomer mixture containing 30% by weight of acrylonitrile, 65% by weight of 1,3-butadiene, and 5% by weight of methacrylic acid, and the temperature was raised to 38°C.
[0116] Thereto was added 0.3 parts by weight of potassium persul...
Embodiment 2
[0123] Embodiment 2: The latex composition that is used for dip molding and the preparation of dip molding article
[0124] Except that 0.1 part by weight of potassium alkenyl succinate (AS200, potassium salt of alkenyl C16-18 succinate, manufactured by LG Household & Health Care Ltd., Korea) was used instead of 0.1 part by weight of potassium alkenyl succinate (LatemulASK) during polymerization. , prepared by KAO, Japan), a glove-shaped dip-molded article was prepared in the same manner as in Example 1 above.
Embodiment 3
[0125] Embodiment 3: The latex composition that is used for dip molding and the preparation of dip molding article
[0126] A glove-shaped dip-molded article was prepared in the same manner as in Example 1 above, except that 0.01 part by weight of potassium alkenyl succinate (Latemul ASK, manufactured by KAO, Japan) was used at the time of polymerization.
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