Methods to increase parasitic light sensitivity
A technology of light sensitivity and MOS tube, which is applied in the field of image processing, can solve problems such as degradation, and achieve the effect of improving parasitic light sensitivity
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Embodiment 1
[0059] Such as image 3 As shown, one end of the first capacitor C1 is connected to the switching unit in the first MOS transistor switch S1 / second MOS transistor switch S2 through the first active area A, and one end of the second capacitor C2 is connected to the switching unit through the second active area B. The switching units in the second MOS transistor switch S2 are connected.
[0060] Among them, such as image 3 As shown, the first active region A includes part of the active region of the first MOS transistor switch S1 and part of the active region of the second MOS transistor switch S2; the second active region B is part of the second MOS transistor switch S2. source area.
[0061] After the first active region A and the second active region B of the MOS transistor switch are selected, the switch unit ( image 3 The S1 area shown, the S2 area) is adjusted and matched, mainly to adjust the channel in the switch unit to compensate and adjust the leakage current of ...
Embodiment 2
[0071] The leakage of the first capacitor C1 / second capacitor C2 node is not only from the channel leakage of the MOS transistor switch, but also from the PN junction leakage and surface leakage of the active region of the MOS transistor switch. Based on this, this embodiment can adjust the matching and The active region structure connected with the capacitor compensates and adjusts the leakage current of the capacitor.
[0072] Optionally, the first active region A and the second active region B are matched to compensate and adjust the leakage current I of the first capacitor C1 sigleak or the leakage current I of the second capacitor C2 rstleak , making Csig*I rstleak =Crst*I sigleak The steps include:
[0073] S2a, providing a MOS tube switch as a test structure;
[0074] S2b. Measuring the relationship between the active region and the leakage current in the test structure;
[0075] S2c. Adjust the first active region A according to the relationship between the active...
Embodiment 3
[0079] Embodiment 1 and Embodiment 2 only change the structure of the MOS tube switch by simply changing the physical size / shape. To adjust the leakage of the MOS tube switch, technological means can also be adopted. For example, ion implantation can be used to change the MOS tube switch. Physical and electrical properties, thereby improving its leakage.
[0080] Based on this, in this embodiment, ion implantation can be performed on the first MOS transistor switch unit S1 / first active region A / second MOS transistor switch unit S2 / second active region B, so that Csig*I rstleak =Crst*I sigleak .
[0081] Optionally, perform ion implantation such that Csig*I rstleak =Crst*I sigleak The steps include:
[0082] S2I, provide MOS tube switch as a test structure;
[0083] S2II. Determining the relationship between the ion implantation of the MOS transistor switch unit / the ion implantation of the active region and the leakage current in the test structure;
[0084] S2III. Accordin...
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