Roll-to-roll covering film laser cutting system and cutting method

Abstract

The invention provides a roll-to-roll covering film laser cutting system and cutting method. The system comprises a controller, a laser device used for emitting a laser beam, an optical coupling system assembly arranged on the front portion of the laser device and used for coupling the laser beam, a scanning galvanometer used for controlling the moving track of the laser beam, a field lens arranged on the output end of the scanning galvanometer, a rolling roller assembly used for unfolding and folding a covering film, a transmission device used for conveying the machined film material and a vacuum absorption transfer device. The optical coupling system assembly is located between the laser device and the scanning galvanometer; the vacuum absorption transfer device comprises a mechanical arm used for transferring the covering film to the transmission device from the rolling roller assembly. According to design, production cost is greatly reduced, product quality is improved, due to thefact that the laser focusing spot is only tens of microns, high-density circuit and micro hole machining can be achieved, due to the advantages, circuit design development space is achieved, and the system is an ideal machining tool of PI covering film windowing.

Description

[technical field] [0001] The present invention relates to the technical field of laser cutting systems, and in particular to a cut covering film that not only has neat and smooth contour edges, is smooth and free of burrs, has no obvious carbonization phenomenon, and has no sharp corners overburned at the corners, which can save high mold costs. The roll-to-roll cover film laser cutting system and cutting method can greatly reduce production costs and improve product quality. [Background technique] [0002] Flexible circuit board (FPC) is widely used in electronic products due to its light weight, high wiring density, and thin thickness. There is usually a layer of resin film on the surface of FPC, which plays the role of line protection and solder resistance. It is an FPC An important part of the product, because its main component is polyimide (Polyimide, PI), it is also called PI covering film in this field. High-temperature-resistant polymers have outstanding dielectric...

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Problems solved by technology

[0003] Before the PI cover film is bonded to the FPC circuit layer, it is necessary to cut windows of different sizes and shapes at the corresponding positions according to the circuit design requirements (also known as PI film window opening in the industry). For a long time in the past, the PI film Cutting is mainly realized by the traditional die-cutting method. This process has problems such as low processing accuracy and high manufacturing cost. With the development of electronic circuit design towards miniaturization and high density, the traditional die-cutting method can no longer meet the design requirements.

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