Vertical continuous plating (VCP) high TP value acidic copper plating gloss agent and preparation method and application thereof

A technology of vertical continuous electroplating and acid copper plating, which is applied in the field of acid copper plating chemical solution for printed circuit boards, can solve the problems that the performance and function cannot keep up with the needs of cutting-edge technological innovation, increase the risk of production control, abnormal technical indicators, etc., and achieve Convenient application, stable product quality, simple and easy operation

Inactive Publication Date: 2018-06-08
韶关硕成化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The shortcomings and influencing factors of the above-mentioned prior art mainly include: (1), copper plating TP value ≤ 1.3; (2), the raw materials used are relatively traditional old raw materials, and their performance and functions cannot keep up with the needs of cutting-edge technological innovation; ( 3) The additive system is designed as three liquids or two liquids, which is not easy to control on the production line, and it is possible to add more or less of one of them, which may cause abnormal technical indicators and increase the risk of production control

Method used

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  • Vertical continuous plating (VCP) high TP value acidic copper plating gloss agent and preparation method and application thereof
  • Vertical continuous plating (VCP) high TP value acidic copper plating gloss agent and preparation method and application thereof
  • Vertical continuous plating (VCP) high TP value acidic copper plating gloss agent and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A kind of vertical continuous electroplating (VCP) high TP value acid copper plating gloss agent, comprises the component of following content:

[0036]

[0037]According to the above formula, weigh 0.5 g of sodium thiazoline-based dithiopropane sulfonate, 1.5 g of polyethyleneimine alkyl salt, 0.5 g of fatty amine polyoxyethylene ether, polyethylene oxide polypropylene oxide monobutyl ether 20g, fatty amine ethoxy sulfonate 1.0g, displacer SLP 2.0g, nitro blue tetrazolium chloride 0.2g, dissolve each raw material component in an appropriate amount of deionized water and mix well, then add deionized Water is adjusted to 200ml, promptly obtains described vertical continuous electroplating (VCP) high TP value acidic copper plating gloss agent, is a kind of brown transparent liquid.

Embodiment 2

[0039] A kind of vertical continuous electroplating (VCP) high TP value acid copper plating gloss agent, comprises the component of following content:

[0040]

[0041]

[0042] The preparation steps are the same as in Example 1. The obtained product is a brown transparent liquid.

Embodiment 3

[0044] A kind of vertical continuous electroplating (VCP) high TP value acid copper plating gloss agent, comprises the component of following content:

[0045]

[0046] The preparation steps are the same as in Example 1. The obtained product is a brown transparent liquid.

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Abstract

The invention discloses a vertical continuous plating high TP value acidic copper plating gloss agent and a preparation method and an application thereof. The acidic copper plating gloss agent comprises the following components of brightener with the concentration being 0.2-0.8 g / 200 ml, a high-temperature carrier with the concentration being 1.0-2.0 g / 200 ml, a leveling agent with the concentration being 0.1-0.2 g / 200ml, an inhibitor A with the concentration being 0.5-1.0 g / 200 ml, an inhibitor B with the concentration being 10-30 g / 200 ml, an inhibitor C with the concentration being 0.5-1.0g / 200 ml, and an acid-copper walking agent with the concentration being 1.0-3.0 g / 200 ml. According to the acidic copper plating gloss agent, in the process of vertical continuous plating acidic copper plating of a flexible printed circuit board, the copper plated thickness in a hole is 1.5-2.5 times of the copper plated thickness of a board surface, plated copper has good ductility and cold and hot shock resistance, and the requirement of the conduction capability of through holes of the circuit board is met.

Description

technical field [0001] The invention belongs to the technical field of acidic copper plating chemical liquid for printed circuit boards (PCB / FPC), and in particular relates to a high TP value acidic copper plating gloss agent for vertical continuous electroplating (VCP), a preparation method and application thereof. Background technique [0002] A printed circuit board (Printed-Circuit-Board, PCB) is an essential part of an electronic product and a motherboard that carries electronic components in an electronic product. At present, electronic products are rapidly developing in the direction of miniaturization, convenience, and intelligence. Multilayer printed circuit boards (HDI-PCB) and flexible printed circuit boards (FPC, also known as soft boards) with high connectivity density are manufacturing One of the important components of these electronic products. Metallized through holes or blind holes are used in multilayer circuit boards and flexible boards to achieve conduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 彭学文简锦坡
Owner 韶关硕成化工有限公司
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