Circuit board manufacturing method and circuit board

Abstract

The invention provides a circuit board manufacturing method and a circuit board manufactured by adopting the circuit board manufacturing method. The circuit board manufacturing method includes steps of providing a conducting substrate and coating the conducting substrate with a photosensitive film which covers a to-be-electroplated area; removing the photosensitive film covering the to-be-electroplated area so as to expose the conducting substrate, and forming a to-be-electroplated window; forming a first circuit in the position of the to-be-electroplated window through copper electroplating;coating the first circuit and the photosensitive film with liquid insulation material so as to form an insulation layer; removing the conducting substrate and forming a second circuit on a side of thefirst circuit away from the insulation layer through copper electroplating; covering the second circuit with a protection film so as to complete manufacture of the circuit board. According to the invention, PI, LCP or PEN material is adopted as a mask and mask removal is not acquired after pattern electroplating, so that the line distance of a circuit obtained after electroplating is reduced andthe copper coating thickness is increased.

Description

technical field [0001] The invention relates to the field of circuit board printing, in particular to a method for manufacturing a circuit board and a circuit board manufactured by using the method for manufacturing a circuit board. Background technique [0002] The current electronic products are rapidly developing in the direction of "short, small, light, and thin". The demand for multi-functional and high-performance electronic products continues to increase, which promotes the continuous reduction in the size of circuit boards and increasingly fine wiring. In this environment, the semi-additive process (Semi-Additive Process, SAP) and the modified semi-additive process (Modified Semi-Additive Process, M-SAP) came into being and are widely used in the circuit board printing industry. [0003] However, in the manufacturing process of the circuit board of the related art, after the SAP process adopts the mask to expose the circuit pattern, the method for directly electropla...

AI Technical Summary

Problems solved by technology

[0003] However, in the manufacturing process of the circuit board of the related art, after the SAP process adopts the mask to expose the circuit pattern, the method for directly electroplating the circuit on the PI (Polyimide, PI) material is used to make the circuit board, but there are coatings and The problem of insufficient bonding strength between PI materials; the M-SAP process can solve the problem of insufficient bonding strength between the above-mentioned coating and PI materials, but it needs to etch the bottom copper, which limits the limit capacity and makes the process more complicated

Moreover, in the SAP process and the M-SAP process, the mask needs to be removed after the electroplating pattern, which makes the copper thickness of the electroplating circuit not too thick, otherwise the film sandwich problem is difficult to solve, which is difficult to meet the needs of some products such as voice coil motors and light-emitting diodes. Circuit Board Requirements for Thick Copper and Fine Lines

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