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Substrate for power module with heat sink, and power module

A technology for power modules and heat sinks, applied in the field of power module substrates and power modules, can solve problems such as damage to bonding reliability, increase in thermal resistance, damage to the adhesion of heat sinks and coolers, etc., and achieve the effect of not easy to warp

Active Publication Date: 2018-06-08
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] If warpage occurs during the mounting process, the position of the soldered joint will shift, or the joint will be skewed or cracked, which may impair joint reliability.
In addition, if warping occurs in the use environment, the thermally conductive grease interposed between the heat sink and the cooler will flow out from between the heat sink and the cooler through the pump-out phenomenon, which may damage the connection between the heat sink and the cooler. adhesion, resulting in an increase in thermal resistance

Method used

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  • Substrate for power module with heat sink, and power module
  • Substrate for power module with heat sink, and power module
  • Substrate for power module with heat sink, and power module

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Embodiment Construction

[0059] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0060] figure 1 as well as figure 2 The power module substrate 101 with a heat sink according to the first embodiment shown in FIG. image 3 As shown in C, the power module 100 is manufactured by mounting a semiconductor element 30 such as a semiconductor wafer on the surface of the heat sink-attached power module substrate 101 .

[0061] The power module substrate 10A includes a ceramic substrate 11, a circuit layer 12 composed of a plurality of small circuit layers 12S bonded to one surface of the ceramic substrate 11 by soldering, and a plurality of small circuit layers 12S bonded to the other surface of the ceramic substrate 11 by soldering. A sheet of metal layer 13 . And, if figure 1 as well as figure 2 As shown, the small circuit layers 12S of the power module substrate 10A are bonded to one surface of the ceramic substrate 11 at intervals. Furthermore, t...

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Abstract

Provided is a substrate for a power module with a heat sink, in which a metal layer and a first layer are formed from aluminum sheets having a purity of 99.99 mass% or greater and a heat sink and a second layer are formed from aluminum sheets having a purity lower than that of the metal layer and the first layer. When a second layer thickness is t1 (mm), a joined surface area is A1 (mm2), yield strength at 25 DEG C is [sigma]11 (N / mm2), yield strength at 200 DEG C is [sigma]12 (N / mm2), a heat sink thickness is t2 (mm), a joined surface area is A2 (mm2), yield strength at 25 DEG C is [sigma]21(N / mm2), and yield strength at 200 DEG C is [sigma]22 (N / mm2), the ratio at 25 DEG C (t1*A1*[sigma]11) / (t2*A2*[sigma]21) is 0.85-1.40 inclusive and the ratio at 200 DEG C (t1*A1*[sigma]12) / (t2* A2*[sigma]22) is greater than 100% but no more than 140% of the ratio at 25 DEG C.

Description

technical field [0001] The present invention relates to a substrate for a power module with a heat sink used in a semiconductor device for controlling large current and high voltage, and the power module. [0002] This application claims priority based on Patent Application No. 2015-200003 for which it applied in Japan on October 8, 2015, and uses the content here. Background technique [0003] A power module substrate with a heat sink is used for an automotive power module. In this power module substrate, an aluminum plate is bonded to a ceramic substrate including aluminum nitride, and an aluminum heat sink is bonded to one side via the aluminum plate. [0004] Conventionally, such substrates for power modules with heat sinks have been manufactured as follows. First, two aluminum plates are stacked on both sides of the ceramic substrate through a brazing material suitable for joining the ceramic substrate and the aluminum plate, and while pressing at a predetermined press...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L23/12H01L25/07H01L25/18
CPCC04B37/026C04B2237/121C04B2237/128C04B2237/343C04B2237/366C04B2237/368C04B2237/402C04B2237/704C04B2237/706H01L23/3735H01L25/072H01L2224/83101H01L2224/32225H01L23/12H01L23/36H01L25/07H01L25/18C04B37/00F28F3/00F28F21/084H01L21/4882
Inventor 大开智哉大井宗太郎
Owner MITSUBISHI MATERIALS CORP
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