Novel mask film and evaporation device

A mask and a new type of technology, applied in the field of new masks and evaporation devices, can solve the problems of mask substrate damage, mask pollution, difficult processing, etc., to reduce the possibility of damage, optimize contact methods, and prevent pollution. Effect

Inactive Publication Date: 2018-06-12
GUAN YEOLIGHT TECH CO LTD
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this structure still has the following problems: first: the mask may damage the surface of the substrate; second: the substrate may pollute the upper surface of the mask; third: the uneven surface of the mask may cause the substrate to crack, etc.
[0006] Although the above two technical solutions use different technical means to make a certain gap between the substrate pattern area and the mask, which can effectively reduce the possibility of damage to the substrate surface by the mask, the above two technical solutions still have the following Probl

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel mask film and evaporation device
  • Novel mask film and evaporation device
  • Novel mask film and evaporation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] see Figure 4 A novel mask disclosed.

[0036] The new mask includes: a mask main body 1 and a mask frame 2 designed integrally with the mask main body 1 and surrounding the mask main body 1, and a specified pattern is formed on the mask main body 1; the mask Mounting holes are distributed on the membrane frame 2 and a supporting structure 3 is arranged in the mounting holes.

[0037] The new mask includes: a mask main body 1 and a mask frame 2 integrally designed with the mask main body 1 and surrounding the mask main body 1, which is the main structure of the mask in this embodiment.

[0038] in:

[0039] The mask main body 1 has a specified pattern formed thereon.

[0040] The mask frame 2 has mounting holes distributed thereon and a supporting structure 3 is arranged in the mounting holes.

[0041] The top of the support structure 3 is in contact with the substrate, which optimizes the contact mode between the substrate and the mask frame. On the one hand, a gap...

Embodiment 2

[0047] see Figure 5 A novel mask disclosed.

[0048] Different from Embodiment 1, in this embodiment, the support structure 3 includes: a support member 5 disposed in the installation hole and a pad 4 installed at the free end of the support member 5 .

[0049] Based on the above design, the support structure 3 is composed of two parts, namely the support 5 and the liner 4, the support 5 is arranged in the installation hole for supporting the liner 4; the liner 4 is installed At the free end of the support 5 there is direct contact with the substrate 6 .

[0050]Based on the above design, the support member 5 of the support structure 3 and the liner 4 can be fixedly connected or detachably connected, and the liner can be replaced during long-term use.

[0051] Based on the above design, support members 5 or pads 4 with the same height or different heights can also be provided at different positions on the mask frame.

[0052] In the case of high flatness on the side of the...

Embodiment 3

[0055] see Image 6 with Figure 7 A novel mask disclosed.

[0056] Different from the second embodiment, in this embodiment, the support member 5 is elastic.

[0057] Image 6 , the elastic support member is in a compressed state, and at this time, the distance between the substrate and the mask frame is relatively small.

[0058] Figure 7 , the elastic support is in a stretched state, and at this time, the distance between the substrate and the mask holder is relatively large.

[0059] Based on the above design, in order to be able to adapt to the substrate, the specific adjustment method of the height of the support structure 3 still depends on the mask holder.

[0060] However, different from Embodiment 2 and Embodiment 1, in this embodiment, the support structures 3 at different positions on the mask frame will have different heights. In the case of uneven masks, elastic supports of different heights can be used The components are used for height compensation, so t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Heightaaaaaaaaaa
Login to view more

Abstract

The invention discloses a novel mask film which comprises a mask film main body and a mask film frame integrally designed with the mask film main body and surrounding the mask film main body. A designated pattern is formed on the mask film main body, mounting holes are distributed in the mask film frame, and supporting structures are arranged in the mounting holes. Compared with the prior art, according to the technical scheme, the mask film main body is not modified, and the influence on the evaporated pattern can be avoided accordingly; and on the basis of further improvement on the technical scheme, the heights of the supporting structures can be adjusted, the situation that fragmenting or cracking occurs to a substrate due to the problem of the lateral flatness of the mask film or thesubstrate is avoided, and pollution on the mask film can be reduced to the largest extent as well.

Description

technical field [0001] The present disclosure generally relates to the technical field of evaporation technology, and in particular relates to a novel mask and an evaporation device. Background technique [0002] Evaporation is the process of evaporating or sublimating the material to be filmed in a vacuum to precipitate on the surface of the workpiece or the substrate. Heating the material and plating it on the substrate is called vacuum evaporation, or vacuum coating. The vacuum coating process is widely used in the manufacturing process of products, such as: hole injection layer, air transport layer, light emitting layer, electron transport layer, etc. of organic light-emitting diode (OLED) display devices. [0003] In the current evaporation process, the film-forming range is defined by a mask, and the structure of the substrate and the mask is: the mask is in contact with the substrate, and the substrate is followed by a back plate and a magnetic plate, and the magnetic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C23C14/04C23C14/24
CPCC23C14/042C23C14/24
Inventor 宋沛张国辉陈旭董艳波胡永岚
Owner GUAN YEOLIGHT TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap