Novel mask film and evaporation device

Abstract

The invention discloses a novel mask film which comprises a mask film main body and a mask film frame integrally designed with the mask film main body and surrounding the mask film main body. A designated pattern is formed on the mask film main body, mounting holes are distributed in the mask film frame, and supporting structures are arranged in the mounting holes. Compared with the prior art, according to the technical scheme, the mask film main body is not modified, and the influence on the evaporated pattern can be avoided accordingly; and on the basis of further improvement on the technical scheme, the heights of the supporting structures can be adjusted, the situation that fragmenting or cracking occurs to a substrate due to the problem of the lateral flatness of the mask film or thesubstrate is avoided, and pollution on the mask film can be reduced to the largest extent as well.

Description

technical field [0001] The present disclosure generally relates to the technical field of evaporation technology, and in particular relates to a novel mask and an evaporation device. Background technique [0002] Evaporation is the process of evaporating or sublimating the material to be filmed in a vacuum to precipitate on the surface of the workpiece or the substrate. Heating the material and plating it on the substrate is called vacuum evaporation, or vacuum coating. The vacuum coating process is widely used in the manufacturing process of products, such as: hole injection layer, air transport layer, light emitting layer, electron transport layer, etc. of organic light-emitting diode (OLED) display devices. [0003] In the current evaporation process, the film-forming range is defined by a mask, and the structure of the substrate and the mask is: the mask is in contact with the substrate, and the substrate is followed by a back plate and a magnetic plate, and the magnetic...

AI Technical Summary

Problems solved by technology

However, this structure still has the following problems: first: the mask may damage the surface of the substrate; second: the substrate may pollute the upper surface of the mask; third: the uneven surface of the mask may cause the substrate to crack, etc.

[0006] Although the above two technical solutions use different technical means to make a certain gap between the substrate pattern area and the mask, which can effectively reduce the possibility of damage to the substrate surface by the mask, the above two technical solutions still have the following Problems need to be solved urgently: first: setting a liner similar to photoresist on the substrate side is easy to contaminate the mask and is not easy to process, which may have an impact on subsequent lamination processes; second: processing the mask side may cause Make it deform and affect the evaporation pattern; third: setting a liner with the same height on the mask side has very high requirements for the flatness of the mask, and the liner and the substrate are in hard contact. In the case of poor flatness, it may will cause the substrate to be fractured

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