Method for manufacturing target material assembly

A manufacturing method and component technology, which are applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problem that the welding structure rate of target components needs to be improved, etc.

Inactive Publication Date: 2018-06-12
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the welding structure rate of the targe

Method used

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  • Method for manufacturing target material assembly
  • Method for manufacturing target material assembly
  • Method for manufacturing target material assembly

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Embodiment Construction

[0034] It can be seen from the background art that a target assembly is generally composed of a target blank that meets the sputtering performance and a back plate that is combined with the target blank and has a certain strength.

[0035]For the target assembly composed of a molybdenum-niobium target blank and a back plate, brazing process is currently mainly used to realize the welding of the molybdenum-niobium target blank and the back plate. The brazing process is to use a solder whose melting point is lower than the melting point of the molybdenum-niobium target blank and the back plate, and heat the solder at a temperature lower than the melting point of the molybdenum-niobium target blank and the back plate and higher than the melting point of the solder. The molybdenum-niobium target blank and the back plate, after the solder on the surface to be welded of the molybdenum-niobium target blank and the surface to be welded of the back plate are melted, the surface to be we...

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Abstract

The invention provides a method for manufacturing a target material assembly. The method comprises the steps that a molybdenum-niobium target blank and a back plate are provided, the to-be-welded faceof the molybdenum-niobium target blank is the first welding face, and the to-be-welded face of the back plate is the second welding face; the first welding face is subjected to surface sandblasting treatment; the first welding face after surface sandblasting treatment is coated with a first solder layer; the second welding face is coated with a second solder layer; and the first welding face coated with the first solder layer and the second welding face coated with the second solder layer are oppositely arranged and attached, and the molybdenum-niobium target blank is welded to the back platethrough the welding technology to form the target material assembly. According to the method, after surface sandblasting treatment, the first welding face is coated with the first solder layer, the roughness of the first welding face can be improved through sandblasting treatment, thus the wettability of the first solder layer on the molybdenum-niobium target blank is improved, and then the subsequent welding structure rate of the molybdenum-niobium target blank and the back plate is increased and can reach 95% or above.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a manufacturing method of a target component. Background technique [0002] Sputtering technology is one of the commonly used processes in the field of semiconductor manufacturing. With the increasing development of sputtering technology, sputtering targets play an increasingly important role in sputtering technology. The quality of sputtering targets directly affects the sputtering technology. Film quality after injection. [0003] In the field of sputtering target manufacturing, the target assembly is composed of a target blank that meets the sputtering performance and a back plate that is combined with the target blank by welding. During the sputtering process, the working environment of the target assembly is relatively harsh. For example: one side of the back plate of the target assembly is forcibly cooled by a certain pressure of cooling water, while one side of...

Claims

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Application Information

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IPC IPC(8): C23C14/34
CPCC23C14/3414
Inventor 姚力军潘杰相原俊夫王学泽段高林
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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