Method and device for machining brittle transparent materials through lasers with multiple focal points distributed dynamically

Abstract

The invention relates to a method and a device for machining brittle transparent materials through lasers with multiple focal points distributed dynamically. A laser outputs a light beam, a beam expander is used for continuously adjusting a diameter and a divergence angle of the light beam, a first reflection unit reflects the light beams to a laser beam primary shaping device, the laser beam primary shaping device is used for carrying out the light beam shaping on the laser beams with a gaussian distribution appeared on energy, the shaped light beam energy is distributed in one or more annular regions, a light beam secondary shaping device is used for shaping the light beam again, the energy distribution and the size of the laser beam are adjusted, the distribution range of the focal point is dynamically controlled, a second reflection unit reflects the light beam to a focus lens, the light beam is focused, the light beam forms the multi-focal points distributed in a limited range, the focal point distribution range includes a machined object; and a X-Y axis motion platform carries the machined object and moves relative to the focus lens. According to the method and the device, the machining of the brittle transparent material is realized by increasing the number of focal points in the optical axis direction through an extension technology based on a laser stress induction cutting technology.

Description

technical field [0001] The invention relates to a laser processing method for brittle transparent materials, in particular to a method and device for processing brittle transparent materials with multi-focus dynamic distribution laser within a limited range, and belongs to the technical field of laser processing. Background technique [0002] At present, for the laser processing technology of brittle transparent materials, laser ablation and gasification are mainly used to remove materials, so as to realize cutting and drilling processing methods. The characteristic of laser ablation is that the laser is focused on the surface of the material (upper surface or lower surface), and through the range of its own focal depth or the movement of the focus up and down, in and out, the purpose of removing material layer by layer is achieved, and finally the required pattern Material is separated from the substrate. This technology is very popular and can be realized by galvanizing m...

AI Technical Summary

Problems solved by technology

This technology is very popular and can be realized by galvanizing mirror or moving focusing mirror. The disadvantages are: first, the efficiency of material removal is low, especially for high hardness materials, such as sapphire, quartz, etc.; second, the edge of the material exists The heat-affected zone usually shows that molten material accumulates on both sides of the edge to form protrusions; third, the side wall cannot be vertical after cutting, and its inclination angle is usually 70-80 degrees, which has a certain impact on subsequent assembly; fourth , the bending strength of the material after cutting is low, and the edge chipping is large

Its characteristics are: first, it does not damage the surface of the material, so there will be no recast accumulation at the edge of the material; second, the verticality of the side wall is high, which can reach more than 85°; its disadvantages are: first, it cannot realize the sealing graphic processing, such as drilling

Second, for thicker materials, the processing efficiency is lower

[0004] The above methods have advantages and disadvantages each other, and each method cannot well cover and meet most processing requirements

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