Stripping method of flexible substrate, and substrate
A substrate substrate and flexible substrate technology, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of difficult laser lift-off process, gaps, etc., and achieve the effect of preventing damage and improving product yield.
Inactive Publication Date: 2018-06-15
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
Most of the current flexible panels use colored polyimide as the base material of the flexible panel. Although it can be used for flexible display, it is still inferior to "display panels with colorless transparent flexible substrates" in terms of aesthetics, visual effects, and application range. there is a big gap
Although the "colorless transparent flexible substrate display panel" has many advantages over the "colored transparent flexible substrate display panel", in terms of ultraviolet light absorption rate, the "colorless transparent flexible substrate" is not as high as the "colored transparent flexible substrate", This makes the "colorless transparent flexible substrate" more difficult to carry out the laser lift-off process
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[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0015] Please see figure 1 , figure 1 It is a schematic flow chart of the first embodiment of the peeling method of the flexible substrate of the present application. Such as figure 1 As shown, it specifically includes:
[0016] S11, providing a base substrate.
[0017] A base substrate 10 is provided, and the base substrate 10 is cleaned to remove organic impurity contamination on the surface of the base substrate 10 . Optionally, the bas...
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Abstract
The invention discloses a stripping method of a flexible substrate, and a substrate. The stripping method comprises the steps of providing the substrate; depositing a stripping layer on the substrate,wherein the stripping layer comprises an amorphous silicon film layer, and the amorphous silicon film layer comprises 5% or above of hydrogen content; forming the flexible substrate on the strippinglayer; and performing illumination on the substrate with the stripping layer and the flexible substrate to enable the flexible substrate to be stripped from the substrate. Through the method, scratching to the surface of the flexible substrate after laser stripping, and damage to a thin film transistor device caused by laser penetration can be prevented, thereby improving the product yield of a flexible display panel in the laser stripping process.
Description
technical field [0001] The present application relates to the technical field of display manufacturing, in particular to a method for peeling off a flexible substrate and a base substrate. Background technique [0002] With the continuous development of flexible panel technology, more and more panel suppliers are beginning to mass-produce flexible panels. Most of the current flexible panels use colored polyimide as the base material of the flexible panel. Although it can be used for flexible display, it is still inferior to "display panels with colorless transparent flexible substrates" in terms of aesthetics, visual effects, and application range. There is a big gap. Although the "colorless transparent flexible substrate display panel" has many advantages over the "colored transparent flexible substrate display panel", in terms of ultraviolet light absorption rate, the "colorless transparent flexible substrate" is not as high as the "colored transparent flexible substrate"...
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IPC IPC(8): H01L21/683
CPCH01L21/6835H01L2221/68318H01L2221/68386
Inventor 孙翔
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD