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Nanometer stainless steel polyethylene composite pipe adhesion resin

A technology of polyethylene and bonding resin, which is applied in the field of polymers, can solve the problems of insufficient bonding strength, poor shear strength, peeling strength, peeling or slipping of the bonding resin, and achieve high adhesion, Objective economic and social benefits, the effect of not easy to fall off

Inactive Publication Date: 2018-07-06
SHANGHAI BANZAN MACROMOLECULE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inner surface of the stainless steel pipe layer and the polyethylene filling layer need to be bonded by a layer of adhesive resin. The general adhesive resin has poor shear strength and peel strength. When the temperature changes, it will peel off or slip. Shifting and other phenomena; and the bonding strength of the bonding resin is not enough, especially for the difficult-to-bond material polyethylene

Method used

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  • Nanometer stainless steel polyethylene composite pipe adhesion resin
  • Nanometer stainless steel polyethylene composite pipe adhesion resin

Examples

Experimental program
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Embodiment 1

[0020] The binder resin in this embodiment, in parts by weight, its preparation raw materials include: 10 parts of polyurethane, 30 parts of low-density polyethylene, 40 parts of linear low-density polyethylene, 10 parts of paraffin, 5 parts of accelerator, antioxidant Agent 0.1. Among them, polyurethane is German Bayer CA-138 polyurethane; the number average molecular weight of low density polyethylene is 300,000, and the density is 0.918g / cm 3 , the melt flow rate of the low-density polyethylene at 190°C and 2.16kg is 10g / 10min; the melt flow rate of linear low-density polyethylene at 190°C and 2.16kg is 20g / 10min; the weight-average molecular weight of paraffin It is 4000; Accelerator is made up of cobalt naphthenate, cobalt isooctanoate, the weight ratio of the two is 1:1; Antioxidant is BASF company product B215.

[0021] The preparation method of the bonding resin in this embodiment includes the steps: (1) uniformly mixing the preparation raw materials according to the ...

Embodiment 2

[0023] The bonding resin in this embodiment, in parts by weight, its preparation raw materials include: 20 parts of polyurethane, 30 parts of low-density polyethylene, 40 parts of linear low-density polyethylene, 10 parts of paraffin, 5 parts of accelerator, antioxidant Agent 0.2. Among them, polyurethane is German Bayer CA-138 polyurethane; the number average molecular weight of low-density polyethylene is 500,000, and the density is 0.935g / cm 3 , the melt flow rate of the low-density polyethylene at 190°C and 2.16kg is 5g / 10min; the melt flow rate of linear low-density polyethylene at 190°C and 2.16kg is 10g / 10min; the weight-average molecular weight of paraffin is 1000; the accelerator is composed of cobalt naphthenate, cobalt isooctanoate, and zinc isooctanoate, and the weight ratio of cobalt naphthenate, cobalt isooctanoate, and zinc isooctanoate is 1:1:3; the antioxidant is BASF’s product B225 .

[0024] The preparation method of the bonding resin in this embodiment in...

Embodiment 3

[0026] The binder resin in this embodiment, in parts by weight, its preparation raw materials include: 10 parts of polyurethane, 20 parts of low-density polyethylene, 30 parts of linear low-density polyethylene, 20 parts of paraffin, 10 parts of accelerator, antioxidant Agent 0.5. Among them, the polyurethane is German Bayer CA-138 polyurethane; the number-average molecular weight of low-density polyethylene is 400,000, and the density is 0.930g / cm 3 , the melt flow rate of the low-density polyethylene at 190°C and 2.16kg is 6g / 10min; the melt flow rate of linear low-density polyethylene at 190°C and 2.16kg is 15g / 10min; the weight-average molecular weight of paraffin It is 5000; Accelerator is made up of N, N-dimethylaniline, N, N-diethylaniline, and the weight ratio of dimethylaniline, N, N-diethylaniline is 1:1; Antioxidant consists of Composed of BASF products 1076 and 3114, the weight ratio of the two is 1:1.

[0027] The preparation method of the bonding resin in this ...

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Abstract

The invention belongs to the technical field of polymers, and particularly relates to a nanometer stainless steel polyethylene composite pipe adhesion resin, a preparation method and applications thereof, wherein the preparation raw materials of the adhesion resin comprise, by weight, 10-20 parts of polyurethane, 20-30 parts of low density polyethylene, 30-40 parts of linear low density polyethylene, 10-20 parts of paraffin, 5-10 parts of an accelerator, and 0.1-0.5 part of an antioxidant. According to the present invention, the adhesion resin has the appearance of milky white granules, has characteristics of stable performance, high adhesive force and less shedding, has the peeling strength of up to more than 10 N / mm, can effectively solve the problem of the influence on the applicabilityof the existing nanometer stainless steel polyethylene composite pipe due to the performance of the adhesion resin, has the low price, and can provide great economic and social benefits to the nanometer stainless steel polyethylene composite pipe industry.

Description

technical field [0001] The invention belongs to the technical field of macromolecules, and in particular relates to a nanometer stainless steel polyethylene composite pipe bonding resin and its preparation and application. Background technique [0002] The nano-stainless steel polyethylene composite pipe includes an adhesive resin layer, a polyethylene filling layer, and a nano-antibacterial material layer. It is located between the adhesive resin layer and the nano antibacterial material layer. The inner surface of the stainless steel pipe layer and the polyethylene filling layer need to be bonded by a layer of adhesive resin. The general adhesive resin has poor shear strength and peel strength. When the temperature changes, it will peel off or slip. and the bonding strength of the bonding resin is not enough, especially for the difficult-to-bond material polyethylene. Contents of the invention [0003] In order to overcome the problems existing in the prior art, the pu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J175/04C09J123/06C09J191/06C09J11/04C09J11/06
CPCC08K2201/014C08L2203/18C08L2205/02C08L2205/035C09J11/04C09J11/06C09J123/0815C08L75/04C08L23/06C08L91/06C08K5/00C08K5/098C08K5/1345C08K5/526C08K5/18C08K5/3492C08K13/02C08K2003/321
Inventor 储江顺毕宏海毕宏江欧阳贵
Owner SHANGHAI BANZAN MACROMOLECULE MATERIAL