Nanometer stainless steel polyethylene composite pipe adhesion resin
A technology of polyethylene and bonding resin, which is applied in the field of polymers, can solve the problems of insufficient bonding strength, poor shear strength, peeling strength, peeling or slipping of the bonding resin, and achieve high adhesion, Objective economic and social benefits, the effect of not easy to fall off
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Embodiment 1
[0020] The binder resin in this embodiment, in parts by weight, its preparation raw materials include: 10 parts of polyurethane, 30 parts of low-density polyethylene, 40 parts of linear low-density polyethylene, 10 parts of paraffin, 5 parts of accelerator, antioxidant Agent 0.1. Among them, polyurethane is German Bayer CA-138 polyurethane; the number average molecular weight of low density polyethylene is 300,000, and the density is 0.918g / cm 3 , the melt flow rate of the low-density polyethylene at 190°C and 2.16kg is 10g / 10min; the melt flow rate of linear low-density polyethylene at 190°C and 2.16kg is 20g / 10min; the weight-average molecular weight of paraffin It is 4000; Accelerator is made up of cobalt naphthenate, cobalt isooctanoate, the weight ratio of the two is 1:1; Antioxidant is BASF company product B215.
[0021] The preparation method of the bonding resin in this embodiment includes the steps: (1) uniformly mixing the preparation raw materials according to the ...
Embodiment 2
[0023] The bonding resin in this embodiment, in parts by weight, its preparation raw materials include: 20 parts of polyurethane, 30 parts of low-density polyethylene, 40 parts of linear low-density polyethylene, 10 parts of paraffin, 5 parts of accelerator, antioxidant Agent 0.2. Among them, polyurethane is German Bayer CA-138 polyurethane; the number average molecular weight of low-density polyethylene is 500,000, and the density is 0.935g / cm 3 , the melt flow rate of the low-density polyethylene at 190°C and 2.16kg is 5g / 10min; the melt flow rate of linear low-density polyethylene at 190°C and 2.16kg is 10g / 10min; the weight-average molecular weight of paraffin is 1000; the accelerator is composed of cobalt naphthenate, cobalt isooctanoate, and zinc isooctanoate, and the weight ratio of cobalt naphthenate, cobalt isooctanoate, and zinc isooctanoate is 1:1:3; the antioxidant is BASF’s product B225 .
[0024] The preparation method of the bonding resin in this embodiment in...
Embodiment 3
[0026] The binder resin in this embodiment, in parts by weight, its preparation raw materials include: 10 parts of polyurethane, 20 parts of low-density polyethylene, 30 parts of linear low-density polyethylene, 20 parts of paraffin, 10 parts of accelerator, antioxidant Agent 0.5. Among them, the polyurethane is German Bayer CA-138 polyurethane; the number-average molecular weight of low-density polyethylene is 400,000, and the density is 0.930g / cm 3 , the melt flow rate of the low-density polyethylene at 190°C and 2.16kg is 6g / 10min; the melt flow rate of linear low-density polyethylene at 190°C and 2.16kg is 15g / 10min; the weight-average molecular weight of paraffin It is 5000; Accelerator is made up of N, N-dimethylaniline, N, N-diethylaniline, and the weight ratio of dimethylaniline, N, N-diethylaniline is 1:1; Antioxidant consists of Composed of BASF products 1076 and 3114, the weight ratio of the two is 1:1.
[0027] The preparation method of the bonding resin in this ...
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Abstract
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