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A kind of preparation method of the epoxy resin matrix composite material of toughening thermal conductivity and insulation

A technology of epoxy resin, heat conduction and insulation, which is applied in the field of modification and preparation of epoxy resin-based composite materials, which can solve problems such as performance degradation, and achieve the effects of increased quality, low peeling yield, and maintenance of bending properties

Active Publication Date: 2020-06-09
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a toughened and thermally conductive and insulating epoxy resin based epoxy resin based on toughening the epoxy resin matrix alone or adding thermally conductive fillers alone. Preparation method of composite material

Method used

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  • A kind of preparation method of the epoxy resin matrix composite material of toughening thermal conductivity and insulation
  • A kind of preparation method of the epoxy resin matrix composite material of toughening thermal conductivity and insulation
  • A kind of preparation method of the epoxy resin matrix composite material of toughening thermal conductivity and insulation

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Embodiment 1

[0058] 1. Preparation of acrylate core-shell particles

[0059] a. Preparation of seed pre-emulsion

[0060] First, add 0.5g anionic emulsifier dipentyl sulfonate sodium dibutyrate and 140g deionized water to a 500ml four-necked flask, stirring and mixing for 15min; then add 0.05g crosslinking agent 1,3-propanediol diol into the four-necked flask Acrylate and 10 g of amyl acrylate were stirred and mixed for 10 minutes to obtain seed pre-emulsion, which was used for later use.

[0061] b. Preparation of core layer monomer pre-emulsion

[0062] Add 1.125g anionic emulsifier sodium diamyl sulfonate, 0.45g crosslinking agent allyl methacrylate and 80g amyl acrylate into the beaker, mix and stir for 15min to obtain the core layer monomer pre-emulsion, which is ready for use .

[0063] c. Preparation of the pre-emulsion of shell monomers

[0064] Into the beaker, add 2.2g anionic emulsifier dipentyl sodium sulfonate, 110g shell monomer ethyl methacrylate, 0.55g crosslinking agen...

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Abstract

The invention relates to a preparation method for a toughness-increasing heat-conduction insulating epoxy-resin-based composite material. The method is characterized by comprising the following steps:(1) preparation of acrylate core-shell particles; (2) preparation of modified boron nitride; and (3) preparation of the epoxy resin / core-shell polymer / boron nitride composite material. According to the preparation method provided by the invention, the obtained composite material has improved impact strength, tensile strength and thermal conductivity, and can be used in the field of microelectronic packaging.

Description

technical field [0001] The invention relates to a preparation method of an epoxy resin-based composite material with high strength, high toughness, high thermal conductivity and insulation, and specifically includes the preparation of acrylate core-shell particles and the modification of boron nitride particles, and the epoxy resin-based composite material. preparation method. It belongs to the field of thermosetting resin modification. Background technique [0002] In recent decades, epoxy resin (EP), as a thermosetting resin with excellent properties, has been widely used in the world. Among them, bisphenol A epoxy resin is represented by the largest output (about 90% of the total epoxy resin output in my country, and about 70% to 80% of the total epoxy resin output in the world), the most widely used, and the Known as general purpose epoxy resin. The epoxy resin described in the present invention is bisphenol A epoxy resin (Bisphenol AEpoxy Resins), which is one of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L33/08C08K9/04C08K9/00C08K3/38C08F220/18C08F220/56C08F2/40
CPCC08F2/40C08F220/18C08K2003/385C08K2201/003C08L63/00C08L2203/206C08L2207/53C08L33/26C08K9/04C08K9/00C08K3/38C08F220/56C08F220/1803
Inventor 瞿雄伟徐晨翟乐吉海峰姚艳梅
Owner HEBEI UNIV OF TECH
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