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Chip packaging material for computer as well as preparation method thereof

A chip packaging, computer technology, applied in the direction of electrical components, circuits, electrical solid devices, etc.

Inactive Publication Date: 2018-07-17
柳州璞智科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the heat dissipation performance of the packaging materials reported above needs to be further improved.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0020] Correspondingly, the present invention also provides a method for preparing a computer chip packaging material, comprising the following steps: mixing 4-10 parts by weight of diethylaminopropylamine, 5-10 parts by weight of chlorophenyl silicone oil, 30-60 parts by weight of novolac epoxy resin Parts by weight, 2-6 parts by weight of chromium carbide, 10-20 parts by weight of polypropylene, 3-8 parts by weight of talcum powder, 1-6 parts by weight of bentonite, 6-13 parts by weight of halloysite nanotubes, mixing, stirring, adding vacuum Degassing treatment in a degassing machine for 1 hour, then curing treatment at 130-140° C., and cooling down to room temperature to obtain a computer chip packaging material.

[0021] The invention provides a chip packaging material for a computer and a preparation method thereof. It is prepared by using the following raw materials according to the weight percentage: 4-10 parts by weight of diethylaminopropylamine, 5-10 parts by weight ...

Embodiment 1

[0025] A computer chip packaging material, calculated according to weight percentage, is prepared from the following raw materials:

[0026] 4 parts by weight of diethylaminopropylamine, 10 parts by weight of chlorophenyl silicone oil, 30 parts by weight of phenolic epoxy resin, 6 parts by weight of chromium carbide, 10 parts by weight of polypropylene, 8 parts by weight of talcum powder, 1 part by weight of bentonite, halloysite 13 parts by weight of nanotubes.

[0027] Preparation steps:

[0028] 4 parts by weight of diethylaminopropylamine, 10 parts by weight of chlorophenyl silicone oil, 30 parts by weight of novolak epoxy resin, 6 parts by weight of chromium carbide, 10 parts by weight of polypropylene, 8 parts by weight of talcum powder, 1 part by weight of bentonite, and 13 parts by weight of the stone nanotubes are mixed, stirred, put into a vacuum degassing machine for degassing treatment for 1 hour, and then cured at 130-140° C., and cooled to room temperature to ob...

Embodiment 2

[0030] A computer chip packaging material, calculated according to weight percentage, is prepared from the following raw materials:

[0031] 10 parts by weight of diethylaminopropylamine, 5 parts by weight of chlorophenyl silicone oil, 60 parts by weight of phenolic epoxy resin, 2 parts by weight of chromium carbide, 20 parts by weight of polypropylene, 3 parts by weight of talc, 6 parts by weight of bentonite, halloysite 6 parts by weight of nanotubes.

[0032] Preparation steps:

[0033] 10 parts by weight of diethylaminopropylamine, 5 parts by weight of chlorophenyl silicone oil, 60 parts by weight of novolac epoxy resin, 2 parts by weight of chromium carbide, 20 parts by weight of polypropylene, 3 parts by weight of talcum powder, 6 parts by weight of bentonite, and 6 parts by weight of the stone nanotubes are mixed, stirred, added to a vacuum degassing machine for degassing treatment for 1 hour, then solidified at 130-140° C., and cooled to room temperature to obtain a c...

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Abstract

The invention provides a chip packaging material for a computer as well as a preparation method thereof. The chip packaging material for the computer is prepared from the following raw materials in parts by weight: 4 to 10 parts of diethylaminopropylamine, 5 to 10 parts of chlorphenyl silicon oil, 30 to 60 parts of novolac epoxy resin, 2 to 6 parts of chromium carbide, 10 to 20 parts of polystyrene, 3 to 8 parts of talcum powder, 1 to 6 parts of bentonite and 6 to 13 parts of halloysite nanotube. Compared with the prior art, the diethylaminopropylamine, the chlorphenyl silicon oil, the novolacepoxy resin, the chromium carbide, the polystyrene, the talcum powder, the bentonite and the halloysite nanotube serve as the raw materials, and the components interact with and influence each other,so the heat-dissipating property of the prepared packaging material is improved and the chip packaging material for the computer is suitable for packaging of chips for the computer.

Description

technical field [0001] The invention relates to the technical field of packaging materials, in particular to a computer chip packaging material and a preparation method thereof. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. It is also a bridge to communicate the internal world of the chip and the external circuit. The contacts on the chip are connected to the leads of the package shell by wires. These pins are connected to other devices through wires on the printed board. Therefore, packaging plays an important role for both CPUs and other integrated circuits. [0003] In the prior art, the Chinese patent literature with application number 200610172320.0 reports a packaging material composition comprising (a) 20-60% by weight of non-siloxane epoxy resin; (b) 5-50% by weight of aromatic Siloxane epoxy resin with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/04C08L23/16C08L83/08C08K13/04C08K7/26C08K3/14C08K3/34H01L23/29
CPCC08L63/04C08K2201/011C08L2203/206C08L2205/03H01L23/295H01L23/296C08L23/16C08L83/08C08K13/04C08K7/26C08K3/14C08K3/34C08K3/346
Inventor 邬凯宇
Owner 柳州璞智科技有限公司
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